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Laser oscillation mechanism

An oscillation mechanism and laser technology, applied in laser welding equipment, laser optical equipment, optics, etc., can solve the problems of halving the energy density, small branching angle, unstable processing quality, etc., to achieve stable processing quality and avoid device enlargement Effect

Inactive Publication Date: 2016-05-18
DISCO CORP
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AI Technical Summary

Problems solved by technology

[0008] Moreover, when a beam splitter is used in order to branch the laser beam oscillated by the laser beam oscillator into a plurality of laser beams to form a plurality of focusing points as in the laser beam irradiation units disclosed in the above-mentioned Patent Documents 1 and 2, it will be divided into The energy density per pulse is halved for p-polarized light and s-polarized light, and the polarization planes are different from each other, resulting in unstable processing quality.
[0009] In addition, if the laser beam is branched using a diffractive optical element (DOE), the energy density of each pulse can be maintained without branching into p-polarized light and s-polarized light, so the above-mentioned problems will not occur. However, due to the diffractive optical element ( The branching angle of DOE) is small, so in order to exclude the zero-order light passing through the diffractive optical element (DOE), it is necessary to install a laser light absorption unit at the center of the diffractive optical element (DOE) at a distance of 1 to several meters. There is a problem making the device larger

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Embodiment Construction

[0023] Hereinafter, preferred embodiments of the laser oscillation mechanism according to the present invention will be described in detail with reference to the drawings.

[0024] figure 1 A perspective view showing a laser processing apparatus provided with a laser oscillation mechanism according to the present invention. figure 1 The shown laser processing apparatus has a stationary base 2 and a chuck arranged on the stationary base 2 so as to be movable in the machining feed direction (X-axis direction) indicated by an arrow X and holds a workpiece. The table mechanism 3 and the laser light irradiation unit 4 arranged on the base 2 and serving as a laser light irradiation unit.

[0025] The above-mentioned chuck table mechanism 3 has: a pair of guide rails 31, 31 arranged in parallel on the stationary base 2 along the X-axis direction; The first slider 32; the second slider 33 disposed on the first slider 32 so as to be movable in the Y-axis direction shown by the arrow ...

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Abstract

The invention provides a laser oscillation mechanism. A laser oscillation mechanism includes a pulse laser oscillator configured to oscillate a pulse laser beam, and a branching unit which branches the pulse laser beam oscillated by the pulse laser oscillator. The branching unit includes a diffraction optical element and a volume Bragg grating. The diffraction optical element(DOE) branches the pulse laser beam oscillated by the pulse laser oscillator into a plurality of laser beams in an effective region. The volume Bragg grating(VBG) refracts, from among the pulse laser beams branched by the diffraction optical element, a particular pulse laser beam to be excluded from the effective region to exclude the particular pulse laser beam.

Description

technical field [0001] The present invention relates to a laser oscillation mechanism installed in a laser processing device or the like for performing laser processing on a workpiece. Background technique [0002] In the manufacturing process of semiconductor devices, a plurality of regions are divided by planned division lines arranged in a grid pattern on the surface of a substantially disc-shaped semiconductor wafer, and devices such as ICs and LSIs are formed on the divided regions. . Then, the semiconductor wafer is cut along the planned dividing line to divide the region where the device is formed. Each semiconductor device is manufactured. [0003] As a method of dividing the above-mentioned wafer, a laser processing method may be attempted in which a pulsed laser beam having a transmissive wavelength is used on the wafer, and a converging point is aligned inside a region to be divided to irradiate the pulsed laser beam. The division method using this laser proces...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/364B23K26/064B23K26/08B23K26/402
CPCB23K26/0648B23K26/0853G02B27/4244G02B27/4272H01S3/005
Inventor 能丸圭司
Owner DISCO CORP
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