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Display device preparation method

A display device, wet etching technology, used in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve the problems of removal, absence of organic polymers, etc., to reduce the number of processes, simplify the process, and build The effect of cost reduction

Active Publication Date: 2019-02-15
EVERDISPLAY OPTRONICS (SHANGHAI) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0013] It can be seen that currently, in the preparation process of display devices with ultra-high aperture ratio, there is no effective method that can save process steps and remove organic polymers.

Method used

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Embodiment Construction

[0037] The invention provides a method for removing organic polymers in the preparation process of high aperture ratio display devices. The invention can be applied to any preparation process of display devices with high aperture ratio or ultra-high aperture ratio that can form organic polymers, such as low temperature Preparation technology of polysilicon device (LTPS), thin film transistor device (TFT), liquid crystal display device (LCD) or active organic electroluminescence display (AMOLED), etc.

[0038] The central idea of ​​the present invention is to completely or partially replace the following two process steps by adopting a chemical basetreatment process when removing organic polymers:

[0039] (1) dry etching to remove the organic polymer;

[0040] (2) Pre-cleaning before electrode deposition.

[0041] The present invention will be described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0042] A conventional tape-out op...

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Abstract

The present invention relates to a method for manufacturing a display device, comprising the steps of: coating a semiconductor structure with an organic material layer; after exposure and development, enabling the organic material layer to form a planar layer with an aperture pattern on the semiconductor structure; performing curing process for the planar layer and forming an organic polymer layer on the surface of the planar layer; after removing the organic polymer layer through wet etching, depositing an electrode layer for covering the upper surface of the planar layer and covering the bottom and sidewalls of the aperture pattern; and providing a data line layer in the semiconductor structure, wherein the planar layer covers the upper surface of the data line layer, and the electrode layer is electrically connected with the data line layer. In comparison with the prior art, the method of the present invention reduces the number of technological processes, simplifies the technological process, and greatly reduces the manufacturing cost of process equipment.

Description

technical field [0001] The invention relates to a semiconductor process, in particular to a method for preparing a display device. Background technique [0002] At present, in the manufacturing process of the display device, the display device is required to have a high aperture ratio, even an ultra-high aperture ratio. [0003] The aperture ratio of the device refers to the ratio between the area of ​​the light-passing part after excluding the wiring part and the transistor part of each pixel (usually hidden by a black matrix) and the overall area of ​​each pixel. Therefore, the higher the aperture ratio of the device, the higher the efficiency of light passing through. [0004] In order to increase the aperture ratio of the device, an organic film process with a high aperture ratio (or ultra-high aperture ratio) is usually used to achieve it, that is, an organic material layer is arranged between two adjacent metal layers to use organic materials to The coupling effect b...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/311H01L21/02H01L21/77
Inventor 廖子毅陈睿林信安林志明黄耀乐
Owner EVERDISPLAY OPTRONICS (SHANGHAI) CO LTD