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touch panel

A touch panel and substrate technology, which is applied in the fields of instruments, computing, electrical and digital data processing, etc., can solve the problems of difficult to reduce the manufacturing cost of the touch panel, and difficult to reduce the manufacturing cost and required man-hours of the large-size touch panel, and achieves The effect of stable electrical performance, reduction of thinness, and reduction of working hours

Active Publication Date: 2019-02-12
TPK MAS TOUCH SOLUTIONS XIAMEN
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  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, with the gradual development of touch panels, whether it is a touch panel with GG architecture (such as: DITO, SITO), GF architecture (such as: GF, GF2), GFF architecture or OGS / TOL architecture, it needs A large number of transparent optical adhesives are used to paste glass, PET film or sensing electrode layer on the substrate, especially the prior art transparent optical film tape OCA (Optical Clear Adhesive) and liquid transparent optical glue LOCA (Liquid Optical Clear Adhesive), It makes it difficult to reduce the manufacturing cost of the touch panel; and in order to cope with the production of a large-scale touch panel, the ITO sputtering process and the multi-channel yellow light lithography process required for the general production of the sensing electrode layer of the touch panel require a larger More expensive vacuum pumping equipment and chambers, as well as a more time-consuming vacuum pumping process, make it difficult to reduce the manufacturing cost and man-hours required for large-scale touch panels, and how does the sensing electrode layer of the ITO sputtering process work on large-scale touch panels? Maintaining good uniformity of the touch panel is a big problem

Method used

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Embodiment Construction

[0026] The technical means adopted by the present invention to achieve the creation purpose are further described below in conjunction with the drawings and preferred embodiments of the present invention.

[0027] see figure 1 and figure 2 As shown, it is a preferred embodiment of the wiring structure of the touch panel of the present invention, which includes a substrate 10, a light shielding layer 13, a circuit layer 14, a first sensing electrode layer 20a, a second sensing electrode layer 20b and a protective layer 30 .

[0028] The substrate 10 has a visible area 11 and at least one non-visible area 12 positioned on one side of the visible area 11. In a specific embodiment, the central part of the substrate 10 is a predetermined visible area 11, and the visible area 11 Surrounding it is a predetermined non-visible area 12, but the position and number of visible areas 11 can vary according to design requirements, for example, they can vary according to the location of th...

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Abstract

The invention relates to a touch panel. The structure of the touch panel comprises a substrate and two induction electrode layers attached to the substrate in a simple attachment manner. Each induction electrode layer is subjected to photolithography process for once so that arrangement of wiring is achieved. A photosensitive resin layer of each induction electrode layer can be attached to the substrate or another induction electrode layer. Therefore, manufacture material is saved and process is reduced so that the purposes of decreasing manufacture cost as well as improving manufacture efficiency are fulfilled.

Description

technical field [0001] The present invention relates to a touch panel, in particular to a simplified structure suitable for a large-sized thin and light touch panel and a manufacturing method thereof. Background technique [0002] With the development of touch technology, the existing touch panels are developing in the direction of large size and thinness. At present, major domestic manufacturers use One Glass Solution (OGS) touch modules as the mainstream. However, with the gradual development of touch panels, whether it is a touch panel with GG architecture (such as: DITO, SITO), GF architecture (such as: GF, GF2), GFF architecture or OGS / TOL architecture, it needs A large number of transparent optical adhesives are used to paste glass, PET film or sensing electrode layer on the substrate, especially the prior art transparent optical film tape OCA (Optical Clear Adhesive) and liquid transparent optical glue LOCA (Liquid Optical Clear Adhesive), It makes it difficult to re...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06F3/041
Inventor 陈永山肖铁飞何宽鑫罗丽
Owner TPK MAS TOUCH SOLUTIONS XIAMEN