Eureka AIR delivers breakthrough ideas for toughest innovation challenges, trusted by R&D personnel around the world.

A mobile terminal with a fingerprint sensor packaging structure

A fingerprint sensor and mobile terminal technology, which is applied in the direction of acquiring/arranging fingerprints/palmprints, instruments, and data processing input/output processes, and can solve the problems of insufficient detection sensitivity of fingerprint sensors.

Active Publication Date: 2020-03-20
SHANGHAI FINGER TECH CO LTD
View PDF4 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The purpose of the present invention is to provide a packaging structure and method for semiconductor capacitive fingerprint sensors applied to mobile terminals and equipment. It adopts a new type of glass-on-glass packaging (Chip On Glass for short COG) packaging technology, so that it can be used in mobile phones and tablet computers. Manufacturers such as mobile terminals do not need to slot the fingerprint sensor in the front panel or rear shell of the mobile phone, but place the fingerprint sensor under the touch panel. COG technology does not change the ID style of the original design of the mobile phone, and does not require users to change it. The habit of using Android mobile phones, and solves the problem of insufficient detection sensitivity of the current technology for semiconductor capacitive fingerprint sensors

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A mobile terminal with a fingerprint sensor packaging structure
  • A mobile terminal with a fingerprint sensor packaging structure
  • A mobile terminal with a fingerprint sensor packaging structure

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0050] The specific embodiment of the present invention will be further described in detail below in conjunction with the accompanying drawings. It should be noted that this invention may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. These embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art, like reference numerals designating like elements throughout.

[0051] First, see figure 1 , figure 1It is a top view of a preferred embodiment of the mobile terminal according to the present invention. In an embodiment of the mobile terminal of the present invention, the mobile terminal includes a housing 20 , a touch screen module 21 and a liquid crystal display 22 . The touch screen module 21 includes a touch sensitive sensor film 30 and a touch cover 200 , and also includes a semiconductor fingerprint sensor 10 . ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
hardnessaaaaaaaaaa
hardnessaaaaaaaaaa
Login to View More

Abstract

The invention discloses a mobile terminal with a fingerprint sensor packaging structure, which adopts the COG (Chip On Glass) packaging technology of a capacitive semiconductor fingerprint sensor; the mobile terminal includes a casing, a display screen, a touch screen cover and a semiconductor capacitive The fingerprint sensor, the touch screen module includes a touch cover plate and a touch sensitive sensor film; the touch screen cover plate is covered on the semiconductor capacitive fingerprint sensor by an anisotropic conductive film. Therefore, in the embodiment of the present invention, the purpose of hiding the fingerprint sensor is achieved by placing the semiconductor capacitive fingerprint sensor under the non-display area of ​​the touch screen. The fingerprint sensor of the present invention has very strong detection sensitivity, and can collect fingerprint images through a touch screen cover plate of hundreds of microns, and adopts the standard COG packaging technology manufacturing process, without making too many changes to the touch screen production process, reducing processing Difficulty and efficiency are improved, and user satisfaction in using the fingerprint recognition sensor is improved.

Description

technical field [0001] The present invention relates to the field of semiconductor packaging, in particular, to a fingerprint sensor packaging technology and a related method, and more particularly, to a mobile terminal with a semiconductor capacitive fingerprint sensor packaging structure. Background technique [0002] Thanks to the rapid development of modern electronic technology, fingerprint recognition technology has begun to enter our daily life and has become the most widely used technology in biometrics. Fingerprint identification technology is to match a person with his fingerprint, and verify his real identity by comparing his fingerprint with the pre-saved fingerprint. Each person's skin texture (including fingerprints) is different in patterns, breakpoints and intersections, that is to say, fingerprint patterns are unique and remain unchanged throughout life. [0003] In recent years, with the rise of Apple's iphone5S fingerprint recognition device Touch ID, the...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): G06K9/00G06F3/044
CPCG06F3/044G06V40/1306G06V40/1329
Inventor 吴磊黄昊徐启波
Owner SHANGHAI FINGER TECH CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com