A Quartz Wafer Grinding Control Method Based on Waveform Matching Method

A waveform matching and quartz wafer technology, which is applied in the direction of grinding devices, grinding machine tools, manufacturing tools, etc., can solve the problems of unable to monitor the state of grinding sand and grinding disc surface, and achieve the effect of preventing overclocking events and improving production efficiency

Active Publication Date: 2018-07-06
RES INST OF ZHEJIANG UNIV TAIZHOU
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Problems solved by technology

However, the ALC system only provides the control strategy of "stopping at the grinding target frequency", and does not involve the monitoring of parameters such as grinding rate and frequency dispersion and the corresponding control strategy, which makes it unable to monitor the state of the grinding sand and the grinding disc surface

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  • A Quartz Wafer Grinding Control Method Based on Waveform Matching Method
  • A Quartz Wafer Grinding Control Method Based on Waveform Matching Method
  • A Quartz Wafer Grinding Control Method Based on Waveform Matching Method

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Embodiment Construction

[0046] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments.

[0047] The frequency measurement and control method proposed by the present invention is aimed at the online frequency measurement system of quartz wafer grinding. The online frequency measurement system is used to obtain information such as the resonant frequency value, grinding rate, and dispersion of the wafer in the process of quartz wafer grinding in real time. Stop the grinder.

[0048] Quartz wafer grinding online frequency measurement system:

[0049] Quartz wafer grinding online frequency measurement system such as figure 1 shown. The online frequency measurement and control method proposed by the invention is applicable to the frequency measurement system built based on the system framework. Quartz chip online frequency measurement system consists of MCU, DDS frequency sweep module, power amplifier circuit module, π network circuit...

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Abstract

The invention discloses a quartz wafer grinding control method based on a waveform matching method, and the frequency from 5 M to 70 MHZ can be stably measured in real time in a quartz wafer grinding process. According to the system, all states in the wafer grinding production process can be displayed, suggestions can be given, and the quartz wafer grinding state can be monitored in real time in an online frequency measuring process; when abnormal situations occur, a grinding machine is shut down in real time, so that overclocking events are prevented, and the production efficiency of a user can be effectively improved according to the states displayed on a touch screen; a frequency hopping constraint strategy is added, so that the problem that frequency measuring values of an ALC system hop at certain frequency bands is completely solved; diverse statistical parameters such as real-time average frequency, grinding speed, scattering difference and the like are provided in the wafer grinding process, a scientific basis is provided for replacing grinding sand and maintaining the surface of a grinding disc, and the defect that the state of the grinding machine cannot be monitored by the ALC system is overcome.

Description

technical field [0001] The invention relates to a control method for quartz wafer grinding based on a waveform matching method. Background technique [0002] The electronic information industry is a pillar industry of the national economy, and quartz crystal oscillators play an extremely important role in the electronic information industry. China is a big producer of quartz crystal components, but there is still a large gap in output value and product quality compared with developed countries. The industry has developed very rapidly in recent years, and the demand for processing equipment and online high-precision measurement and control equipment in the production process of quartz crystal components is also increasing. [0003] Wafer grinding is an essential step in the production process of quartz crystal oscillators. Wafer electrical parameter testing is the key measurement and control technology in this step. Many domestic research institutions have carried out resear...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B24B37/005
CPCB24B37/005G01R23/02
Inventor 潘凌锋郭彬陈浙泊陈一信
Owner RES INST OF ZHEJIANG UNIV TAIZHOU
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