Refrigeration device

Abstract

The invention provides a refrigeration device to prevent reliability reduction and cost increase. An air conditioner (1) comprises an electronic part (60) heating upon connection, a printing base plate (71) for an installation of a cooled element, a liquid refrigerant distribution tube (35) and a refrigerant sleeve (29) cooling the cooled element. The cooled element is equipped with a main body part (61) and a plurality of lead wires (62) extending out of the main body part; the refrigerant sleeve is arranged between the main body part and the liquid refrigerant distribution tube and abutted against the main body part and the liquid refrigerant distribution tube; the cooled element is fixed on the refrigerant sleeve via the main body part, so the lead wires can be joined with the printing base plate and the printing base plate can be installed; the cooled element is installed on the printing base plate and between the refrigerant sleeve and the printing base plate; and one part of the lead wires are coated with anti-wetting material (90) preventing dews.

Description

technical field [0001] The present invention relates to a refrigeration device. Background technique [0002] Conventionally, there is a refrigerating apparatus including a refrigerant sleeve that is thermally connected to refrigerant piping and electronic components mounted on a substrate, and that cools electronic components that generate heat during operation. For example, the refrigerating apparatus disclosed in Patent Document 1 (Japanese Patent Laid-Open No. 2013-225582 ) includes a refrigerant sleeve that abuts between the refrigerant piping and the power equipment. When assembling the above-mentioned refrigeration apparatus, assemblability is generally considered, and electronic components, which are objects to be cooled, are mounted on the substrate in a state of being fixed to the main body of the refrigerant sleeve. In Patent Document 1, a power device that is an object to be cooled is fastened to the main body of the refrigerant sleeve with screws before being m...

AI Technical Summary

Problems solved by technology

[0004] However, when the method of Patent Document 2 is applied to Patent Document 1, the entire substrate in the state where the main body of the refrigerant sleeve is mounted is coated with a moisture-proof material. Resulting in reduced thermal conductivity of the refrigerant sleeve and potentially reduced reliability

[0005] In addition, when the entire substrate is coated with a moisture-proof material, it is also conceivable that the thermal resistance of the electronic parts increases, and the heat dissipation of the electronic parts during operation decreases, resulting in a decrease in reliability.

[0006] In addition, when the entire substrate is coated with a moisture-proof material, the cost increases in relation to the usage amount of the moisture-proof material.

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