A kind of automatic continuous electroplating method

Abstract

The invention provides an automatic continuous electroplating method. A board-taking up / placing integrated machine is arranged between a horizontal copper deposition line and a vertical continuous electroplating line; one side surface of the vertical continuous electroplating line is provided with a plating companion board temporary storage device; one side surface of the board-taking up / placing integrated machine is provided with a taking up / placing board temporary storage device; the control signal of the horizontal copper deposition line is connected with the control signal of the vertical continuous electroplating line; and the transmission speed of the horizontal copper deposition line and the transmission speed of the vertical continuous electroplating line are debugged to be same, and the transmission speeds, debugged to be same, of the horizontal copper deposition line and the vertical continuous electroplating line are locked. The automatic continuous electroplating method is easy to operate; the operation method is easy to grasp; the method is easy to realize and wide in application range; the middle board transfer flow is saved, thereby greatly improving work efficiency, saving manpower and material resources, reducing production cost, preventing scratch due to board transfer and conveying, ensuring quality of the product effectively and not causing waste of production power; and the method is stable in operation, and can prevent loss due to production fault, reduce loss of a production line, and prolong the service life of the production line.

Description

technical field [0001] The invention relates to an electroplating method for PCB boards, in particular to an automatic continuous electroplating method. Background technique [0002] PCB board, also known as printed circuit board, printed circuit board, referred to as printed board, is based on an insulating board, cut to a certain size, with at least one conductive pattern attached to it, and holes (such as component holes, fastening holes, metallized holes, etc.), and realize the interconnection between electronic components. Since such boards are made using electronic printing, they are called "printed" circuit boards. In the PCB manufacturing process, after the PCB board is drilled, the holes need to be metallized. [0003] At present, the commonly used metallized hole operation process is drilling-horizontal copper deposition-vertical continuous electroplating-the next process. The conduction function of the drilled hole is realized by sequentially performing horizont...

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Problems solved by technology

[0003] At present, the commonly used metallized hole operation process is drilling-horizontal copper deposition-vertical continuous electroplating-the next process. The conduction function of the drilled hole is realized by sequentially performing horizontal copper deposition and vertical continuous electroplating. Continuous electroplating is operated separately. Therefore, in the actual production process, the staff needs to collect the PCB board from the horizontal copper plate receiving section, and then transfer it to the vertical continuous board. It is easy to cause scratches during the transfer of the PCB board, and It is time-consuming and labor-intensive, and the labor cost is greatly increased. In addition, if the PCB board cannot be transferred to the vertical continuous electroplating line for electroplating in time after the horizontal copper sinking, it will easily cause the oxidation of the PCB board surface, which will seriously affect the electroplating quality and reduce the excellent rate of finished products.

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