Manufacturing method for part with capillary-structure pipe embedded therein

Abstract

The invention discloses a manufacturing method for a part with a capillary-structure pipe embedded therein. Through material additive manufacturing, the part, a pipe body and capillary structures are integrated, so that the maximum heat transfer capacity of the part is effectively improved, and the heat conduction efficiency is improved. The shape and size of the embedded pipe are flexibly designed according to the arrangement demands of a heat radiating space, and the part is especially suitable for the miniaturization development of electronic equipment. Meanwhile, the high heat conductivity formed through the capillary structures can meet the requirement of the unit area radiating amount by electronic devices with a high heat-flux density. The method also has the characteristics of being simple, rapid, low in input cost, small in material consumption and the like, and the method can be widely applied to radiating and cooling of high heat-flux density equipment such as electronic equipment, machines, chemicals and space vehicles.

Description

technical field [0001] The invention relates to the field of component manufacturing. Background technique [0002] The ability of a substance to conduct heat is called thermal conductivity. If some parts need to absorb or dissipate a lot of heat during use, materials with good thermal conductivity should be used. However, thermal conductivity is often not compatible with other properties such as mechanical properties when selecting part materials. In particular, many new materials (polymers, alloys, ceramics, etc.) developed in recent years have excellent mechanical properties, but when they are made into parts, the end close to the heat source or generating heat cannot quickly transfer heat to the end far away from the heat source. At one end, the temperature difference of the entire part is relatively large, which has a serious impact on the life of the part itself and the reliability of the entire device. [0003] In the prior art, the problem of heat dissipation of pa...

AI Technical Summary

Problems solved by technology

But the traditional method is difficult to deal with some tiny parts, especially the treatment of the inner surface of the parts, and even cause structural damage

With the rapid development of the microelectronics industry, the heat flux of electronic devices continues to increase. Traditional manufacturing techniques are difficult to improve the heat transfer limit of parts, which seriously limits the development of microelectronic components.

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