A method for manufacturing an optical fiber array for optical coupling, a coupling method, and a device

Abstract

The invention provides a manufacturing method for an optical fiber array for optical coupling and a coupling method and device.The manufacturing method for the optical fiber array comprises the following steps that naked fibers of the optical fiber array are pressed into a V-shaped groove, the tail end of a bare wire is aligned to the tail end of the V-shaped groove, the bare wire pressed into the V-shaped groove is covered with cover glass to be fixed, the cover glass does not cover the tail end of the V-shaped groove, the distance between the tail end of the cover glass and the tail end of the V-shaped groove is larger than the depth distance between steps of a silicon optical chip coupled to the optical fiber array, and the tail end of the optical fiber array is supported under the V-shaped groove to form one step; an adhesive is dispensed on the portion, not covered with the cover glass, of the bare wire so as to fix the bare wire; a filler aligned to the tail end of the V-shaped groove is applied to the step at the tail end of the optical fiber array; the end face of the optical fiber array is polished, the filler is removed after polishing is performed, and the step is exposed.By adopting the step-type optical fiber array, the problem that coupling losses are large due to the fact that a common optical fiber array is far away from the coupling end face of the chip is solved.

Description

technical field [0001] The present invention relates to a method for manufacturing an optical communication device, in particular to a method for manufacturing an optical fiber array for optical coupling, in particular to a method for manufacturing an optical fiber array applied to silicon optical chip coupling and its coupling method, silicon optical chip Device, the invention belongs to the communication field. Background technique [0002] In recent years, with the continuous development of CMOS technology, the feature size of IC chip tape-out process has become smaller and smaller, which provides a broad development space for silicon photonics based on submicron-sized optical waveguides. Compared with traditional InP integrated optoelectronic chips, silicon photonics has many advantages such as small size, high integration, and low cost. As one of the most promising solutions for on-chip optical interconnection, silicon photonics has become a hot topic in the industry. ...

AI Technical Summary

Problems solved by technology

The thickness of a silicon photonics chip is generally on the order of hundreds of microns, and the etching depth of the SSC coupling end is usually smaller than the thickness of the chip. Because of this height difference, a step will be formed at the SSC coupling end of the edge of the silicon photonic chip, which gives the chip Coupling with optical fiber brings some difficulties

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