Manufacturing method of composite LED aluminum-base glass-base panel

Abstract

The invention relates to a manufacturing method of a composite LED (Light Emitting Diode) aluminum-base glass-base panel. The manufacturing method comprises the following steps of preparing a glass-base aluminum-base mould plate; pasting light-exiting surfaces of various kinds of monochromatic LED wafers onto a plurality of pieces of first lining paper; grading the various kinds of monochromatic LED wafers; performing reverse mould treatment on the graded monochromatic LED wafers; after the reverse mould treatment, pasting electrode sides of the various kinds of monochromatic LED wafers onto a plurality of pieces of second lining paper; respectively performing reverse mould treatment on the various kinds of monochromatic LED wafers carried by the plurality of pieces of second lining paper onto one piece of third lining paper, and performing wafer expanding operation; charging the various kinds of monochromatic LED wafers arranged on the third lining paper into a matrix groove; performing positioning hot pressing on the glass-base aluminum-base mould plate and the various kinds of monochromatic LED wafers, so that a glass-base plate is in a molten state, and is used for embedding the various kinds of monochromatic LED wafers into the matrix groove of the glass-base aluminum-base mould plate after the cooling; after the cooling, the first surface is subjected to grinding polishing; and after the annealing, the composite LED aluminum-base glass-base panel is obtained.

Description

technical field [0001] The invention relates to the field of semiconductors, in particular to a method for manufacturing a composite LED aluminum-based glass-based panel. Background technique [0002] The traditional LED display technology has a bottleneck in the high-density field, because it is limited by the traditional structure of the LED light source and the material structure involved in the post-integration processing module, such as the drive capacity and structure of the traditional constant current source package. The thermal instability and flatness and strength of the integrated product brought about by the loose material of the traditional FR4 circuit board, as well as the reliability of the injection-molded mask and plastic case required for installation and splicing into a large screen, all severely limit The breakthrough of LED display technology in the field of high density. [0003] Therefore, it is an urgent problem to be solved how to realize an LED dis...

AI Technical Summary

Problems solved by technology

[0002] The traditional LED display technology has a bottleneck in the high-density field, because it is limited by the traditional structure of the LED light source and the material structure involved in the post-integration processing module, such as the drive capacity and structure of the traditional constant current source package. The thermal instability and flatness and strength of the integrated product brought about by the loose material of the traditional FR4 circuit board, as well as the reliability of the injection-molded mask and plastic case required for installation and splicing into a large screen, all severely limit Breakthrough of LED display technology in the field of high density

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