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Separated cavity packaging structure of integrated sensor

A technology integrating sensors and packaging structures, applied in the field of microphones, can solve the problems of limited product performance improvement, adverse effects of MEMS chips, and small back cavity of MEMS chips, so as to reduce the impact, increase the space of the back cavity, and improve perception. effect of speed

Inactive Publication Date: 2016-06-29
GOERTEK INC
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  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

These two structures are prone to external airflow, dust, etc. entering the packaging chamber where the MEMS chip is located directly through the sound hole and through hole, causing adverse effects on the work of the MEMS chip, and the back cavity of the MEMS chip is small, which improves product performance. restricted

Method used

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Embodiment Construction

[0029] The core of the present invention is to provide a sub-cavity packaging structure for integrated sensors, which reduces the adverse effects of external airflow and dust on MEMS chips.

[0030] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0031] Please refer to figure 1 , figure 2 , image 3 and Figure 4 As shown, the embodiment of the present invention provides a sub-cavity packaging structure of an integrated sensor, including a MEMS chip 7, an ASIC chip 6, a circuit board 1, a housing and an enviro...

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Abstract

The invention discloses a separated cavity packaging structure of an integrated sensor. The structure comprises an MEMS (Micro-Electro-Mechanical System) chip, an ASIC chip, a circuit board, a shell and an environment sensor. The shell and the circuit board form a packaging body. A first packaging cavity and a second packaging cavity which are mutually isolated are arranged in the packaging body. The MEMS chip and the ASIC chip are located in the first packaging cavity. The environment sensor is located in the second packaging cavity. The second packaging cavity is equipped with a through hole communicated with an external environment. A sound hole channel is arranged in the circuit board. The inlet of the sound hole channel aligns with the MEMS chip. The outlet of the sound hole channel is communicated with the second packaging cavity. According to the separated cavity packaging structure, the MEMS chip is communicated with the second packaging cavity through the sound hole channel in the circuit board; the back cavity is increased; the product performance is improved; moreover, the sensing speed of the environment sensor is improved through the large through hole; the external airflow or dusts are not liable to enter into the first packaging cavity through the sound hole channel; and therefore, bad influences resulting from the external airflow or dusts on the MEMS chip are eliminated.

Description

technical field [0001] The invention relates to the technical field of microphones, in particular to a sub-cavity packaging structure of an integrated sensor. Background technique [0002] The full English name of MEMS is Micro-Electro-Mechanical System, and the Chinese name is micro-electro-mechanical system. It refers to a high-tech device with a size of a few millimeters or even smaller. Its internal structure is generally on the order of microns or even nanometers. It is an independent intelligent system. Due to the advantages of miniaturization, intelligence, high integration and mass production, MEMS technology has been widely used in the fields of electronics, medicine, industry, automobile and aerospace systems. [0003] In electronic products, MEMS microphones have become the first choice for mid-to-high-end portable smart electronic devices. The core component of MEMS microphones is MEMS chips, which are used for sound-electric conversion. A MEMS microphone usuall...

Claims

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Application Information

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IPC IPC(8): H04R19/04
CPCH04R19/04H04R2201/003
Inventor 端木鲁玉
Owner GOERTEK INC
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