Separated cavity packaging structure of integrated sensor
A technology integrating sensors and packaging structures, applied in the field of microphones, can solve the problems of limited product performance improvement, adverse effects of MEMS chips, and small back cavity of MEMS chips, so as to reduce the impact, increase the space of the back cavity, and improve perception. effect of speed
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Example Embodiment
[0029] The core of the present invention is to provide a sub-cavity packaging structure for integrated sensors, which reduces the adverse effects of external airflow and dust on the MEMS chip.
[0030] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative work shall fall within the protection scope of the present invention.
[0031] Please refer to figure 1 , figure 2 , image 3 with Figure 4 As shown, the embodiment of the present invention provides a sub-cavity packaging structure for integrated sensors, which includes a MEMS chip 7, an ASIC chip 6, a circuit board 1...
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap