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Surface-treated metal powder, and method for producing same

A technology of surface treatment and manufacturing method, which is applied in the direction of metal processing equipment, cable/conductor manufacturing, fixed capacitor parts, etc., and can solve the problems of long mixing time and unsuitability

Active Publication Date: 2016-06-29
JX NIPPON MINING & METALS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As described in the patent literature, the mixing time of this method and the time required for the volatilization step of the organic solvent are long, and from the viewpoint of productivity, it is not suitable for industrial implementation

Method used

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  • Surface-treated metal powder, and method for producing same
  • Surface-treated metal powder, and method for producing same
  • Surface-treated metal powder, and method for producing same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0191] Hereinafter, examples are given to describe the present invention in further detail. However, the present invention is not limited by the following examples.

[0192] [metal powder]

[0193] As the metal powder, copper powder, nickel powder, and silver powder were prepared in the following order.

[0194] (copper powder produced by the disproportionation method (used in addition to Example 6))

[0195] 20 g of copper powder for surface treatment was produced by the above-mentioned wet method using the disproportionation method. Specifically, it was carried out in the following order.

[0196] (1) Add 50 g of cuprous oxide to 0.05 to 0.4 g of gum arabic + 350 mL of pure water.

[0197] (2) Next, 50 mL of 25 wt % dilute sulfuric acid was temporarily added.

[0198] (3) This was left to stand for 60 minutes after being stirred with a rotating paddle (300 rpm×10 minutes).

[0199] (4) Next, the precipitate is washed.

[0200] When cleaning, first remove the supernata...

Embodiment 5

[0265] In order to confirm that the sintering retardation property of the present invention is maintained even if the surface-treated copper powder obtained in the above-mentioned Example 2 is further subjected to antirust treatment, the following experiment (Example 5) was performed.

[0266] After the surface-treated copper powder was obtained in Example 2, it was dispersed in 100 mL of 0.1 g / L benzotriazole aqueous solution in order to perform antirust treatment with an organic compound, stirred at 500 rpm for 10 minutes with a rotating paddle, and filtered , drying (70 ℃ * 1 hour under nitrogen environment), and then obtained the copper powder (embodiment 5) through antirust treatment. The antirust-treated copper powder was evaluated in accordance with the procedure of Example 2. It should be noted that the metal powders treated with antirust were evaluated, and the results are summarized in Tables 1 to 3. The size of the metal powders "after treatment" in Table 2 refers t...

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Abstract

Provided are a surface-treated copper powder and a metal powder that exhibit superior sinter delay properties and are suitable for use in the manufacture of electrodes for multilayer ceramic capacitor chips. The surface-treated metal powder has an N (nitrogen) content of at least 0.02 wt% relative to the surface-treated metal powder, and satisfies the formulas 50 <= x <= 1500 and y >= 0.2x + 600, in which x is the coating mass per 1 g of metal powder of one element selected from the group consisting of Al, Si, Ti, Zr, Ce, and Sn, and in which y (DEG C) is the starting temperature of sintering. Also provided is a method for producing the powders.

Description

Technical field [0001] The present invention involves the copper powder and metal powder, and its manufacturing methods that can be used to make chip layers of ceramic capacitors and have excellent sintering delay. Background technique [0002] Due to the characteristics of the chip layer of ceramic capacitors, it has become an electronic component used in a variety of electronic instruments due to its small and large capacity.The chip layer combines ceramic capacitors to overlap the ceramic electrical medium and the internal electrode into a layer -shaped structure. The layers of the layers form the capacitors components.A small and large capacitor. [0003] In the manufacturing of the chip layer of ceramic capacitors, the electronics thin slices are manufactured below.That is, first, to the BATIO 3 Add a dispersant or solvents for an electrical raw material powder or an organic adhesive and solvent for the molding auxiliary. After the crushing, mixing, and bubbling steps are ob...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B22F1/02B22F1/00H01B1/00H01B1/22H01B5/00H01B13/00H01G4/12H01G4/232H01G4/30B22F1/05B22F1/107B22F1/16
CPCH01G4/30H01B1/22C09D5/24H01G4/008B22F1/05B22F1/107B22F1/16B22F1/09H01G4/0085
Inventor 古泽秀树
Owner JX NIPPON MINING & METALS CORP
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