Cooling device and method of use thereof

Abstract

The invention provides a cooling device and an application method thereof. According to the cooling device and the application method thereof, in consideration of the influence of pressure drop of a refrigerant on the temperature of the refrigerant, effective improvement is made in the structure of a double-layer multi-process cooling device, the design that in the prior art, all processes of a first layer, directly communicating with a refrigerant inlet, of the double-layer multi-process cooling device are arranged on a leeward layer is abandoned, accordingly the effect that the arrangement order of all the processes meets a countercurrent design principle better is ensured, and a better cooling effect can be achieved compared with the existing double-layer multi-process cooling device.

Description

technical field [0001] The invention relates to a cooling device and a using method thereof, belonging to the field of air-conditioning cooling devices. Background technique [0002] The double-layer multi-pass cooling device includes two layers consisting of headers, flat tubes and fins, and the refrigerant in fluid state flows in the headers and flat tubes. According to the flow direction of the refrigerant in the flat tubes, each layer can also be divided into two or more processes, and the flow direction of the refrigerant in the flat tubes in the same process is the same. Theoretically, when the cooling device is used as an evaporator, since the refrigerant continuously absorbs heat from the outside during the flow process, its temperature should continue to increase. That is to say, among all the processes of the cooling device, the temperature of the refrigerant in the process in which the refrigerant flows first should be the lowest, and the temperature of the refri...

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Problems solved by technology

[0003] However, in the actual use of the cooling device as an evaporator, the pressure of the refrigerant will continue to drop as it flows inside the cooling device, and the pressure drop will cause the temperature of the refrigerant to drop to a certain extent

In some processes of the above-mentioned double-layer multi-process cooling device, the cooling effect caused by the depressurization process may offset or even exceed the heating effect caused by the refrigerant absorbing heat from the outside.

In this way, for the above-mentioned double-layer multi-process cooling device, although the refrigerant in the first layer absorbs less heat from the outside, since the first layer is directly connected to the refrigerant inlet, the refrigerant therein has not been fully cooled. Pressure reduction, the cooling effect caused by the pressure reduction is not obvious, while the refrigerant in the second layer has undergone more sufficient pressure reduction, and the cooling effect caused by the pressure reduction is more obvious

Therefore, in some processes of the second layer, the cooling effect caused by depressurization may exceed the temperature rise effect caused by the refrigerant absorbing heat from the outside, resulting in the fact that the temperature of the refrigerant in some processes of the second layer may be lower instead. The temperature of the refrigerant in the part of the process on the first floor

Therefore, setting all the processes on the first floor in the leeward layer and all the processes on the second layer in the windward layer may not actually conform to the principle of counterflow design, and it is difficult to achieve the best cooling effect

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