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Radio-frequency switching device and forming method thereof

A technology of radio frequency switches and devices, which is applied in the direction of semiconductor devices, semiconductor/solid state device manufacturing, electrical components, etc., can solve the problems that the performance of radio frequency switch devices needs to be improved, and achieve the effect of reducing the equivalent off-state capacitance and enhancing the isolation performance

Active Publication Date: 2016-07-06
SHANGHAI HUAHONG GRACE SEMICON MFG CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, the performance of the RF switching devices formed in the prior art needs to be improved

Method used

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  • Radio-frequency switching device and forming method thereof
  • Radio-frequency switching device and forming method thereof
  • Radio-frequency switching device and forming method thereof

Examples

Experimental program
Comparison scheme
Effect test

no. 1 example

[0036] image 3 , Figure 4 and Figure 5 is a schematic diagram of the radio frequency switching device in the first embodiment of the present invention, wherein, image 3 It is a top view of the radio frequency switching device in the first embodiment of the present invention, Figure 4 for along image 3 Sectional view obtained by cutting line A1-A2.

[0037] combined reference image 3 and Figure 4 , The radio frequency switching device includes: a substrate 200; a gate structure G021 located on the substrate 200; a source region and a drain region respectively located in the substrate on both sides of the gate structure G021; a source metal layer S021 located on the substrate 200, the source metal layer S021 is correspondingly connected to the source region; the drain metal layer D021 is located on the substrate 200, the drain metal layer D021 is correspondingly connected to the drain region, and the source metal layer S021 is And the drain metal layer D021 has a di...

no. 2 example

[0068] The difference between the second embodiment and the first embodiment is that the metal layer is projected onto the top surface of part of the source metal layer and part of the drain metal layer. In this embodiment, a case where the metal layer is projected onto the top surfaces of part of the source metal layer and part of the drain metal layer is exemplified. The parts of the second embodiment that are the same as those of the first embodiment will not be described in detail again.

[0069] Figure 6 and Figure 7 is a schematic diagram of the radio frequency switching device in the second embodiment of the present invention, wherein, Figure 6 It is a top view of the radio frequency switching device in the second embodiment of the present invention, Figure 7 for along Figure 6 Sectional view obtained by cutting line A2-A3.

[0070] combined reference Figure 6 and Figure 7, The radio frequency switching device includes: a substrate 300; a gate structure G0...

no. 3 example

[0087] The difference between the third embodiment and the second embodiment is that the metal layer is a comb structure. The parts of the third embodiment that are the same as those of the second embodiment will not be described in detail.

[0088] Figure 8 , Figure 9 and Figure 10 It is a schematic diagram of the radio frequency switching device in the third embodiment of the present invention, wherein, Figure 8 , Figure 10 is a top view of the radio frequency switching device in the third embodiment, Figure 9 for Figure 8 The three-dimensional schematic diagram corresponding to the middle metal layer.

[0089] When the metal layer has a comb structure, the metal layer includes comb teeth of the metal layer and a comb handle of the metal layer, the comb teeth of the metal layer are located on one side of the comb handle of the metal layer, and the metal layer The extension direction of the comb handle of the layer is perpendicular to the extension direction of ...

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PUM

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Abstract

The invention provides a radio-frequency switching device and a forming method thereof. The radio-frequency switching device comprises a base, gate structures, source regions, drain regions, source metal layers, drain metal layers and a metal layer, wherein the gate structures are located on the base; the source regions and the drain regions are located in the base at two sides of the gate structures; each source metal layer is located on the base and is connected with the corresponding source region; each drain metal layer is located on the base and is connected with the corresponding drain region; the source metal layers and the drain metal layers are provided with dielectric layers; the metal layer is located on the dielectric layers; and the metal layer is at least projected to the top surfaces of partial source metal layers and partial drain metal layers. According to the radio-frequency switching device, the isolating properties of the drain metal layers and the source metal layers in an off state are strengthened.

Description

technical field [0001] The invention relates to the field of semiconductor manufacturing, in particular to a radio frequency switch device and a forming method thereof. Background technique [0002] The radio frequency switching device is an important switching device, which belongs to the signal switch in the communication field, and can be applied to the wired transmission of radio frequency signals. When the radio frequency switching device is working, some areas are in a conduction state, and some areas are in an off state. Figure of Merit (FOM for short) is a characteristic test parameter for evaluating the performance or process of a radio frequency switching device. FOM=R on *C off , where R on is the equivalent resistance value when the RF switching device is in the on state, C off is the equivalent capacitance value when the RF switching device is in the off state. C off It is a parameter to measure the isolation performance of the RF switching device in the ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L29/78H01L29/417H01L29/423H01L21/336
CPCH01L29/41758H01L29/4232H01L29/66477H01L29/7838
Inventor 刘张李
Owner SHANGHAI HUAHONG GRACE SEMICON MFG CORP