Heat dissipation structure of electronic device, wearable electronic equipment and heat dissipation method of electronic device

Abstract

The invention is suitable for the technical field of heat dissipation of electronic devices, and discloses a heat dissipation structure of an electronic device, wearable electronic equipment and a heat dissipation method of the electronic device. The heat dissipation structure of the electronic device comprises a circuit board and the electronic device, wherein the electronic device is connected to the circuit board; a conductive circuit layer is arranged on the surface, connected with the electronic device, of the circuit board; a heat-conducting solder resist ink layer is arranged on the surface of the conductive circuit layer; a heat-conducting underfill adhesive is arranged between the bottom part or/and the side surface of the electronic device and the heat-conducting solder resist ink layer; a shielding cover covers the electronic device and is connected to the circuit board; and the wearable electronic equipment has the heat dissipation structure of the electronic device. According to the heat dissipation structure of the electronic device, the wearable electronic equipment and the heat dissipation method of the electronic device, the heat conduction effect and the heat dissipation effect are improved, so that the condition that the electronic device can reliably and stably work is ensured; and the reliability of a product is good.

Description

technical field [0001] The invention belongs to the technical field of heat dissipation of electronic devices, and in particular relates to a heat dissipation structure of an electronic device, a wearable electronic device and a heat dissipation method thereof. Background technique [0002] Current electronic devices, such as wearable electronic devices, such as smart watches, have small structural space and small heat dissipation area, resulting in large heat generation and high temperature of the whole machine; if the commonly used graphite heat dissipation film is attached to the surface of the IC, the effect Limited; if metal materials such as copper foil are used to increase the heat dissipation area, the cost will increase and the thickness of the product cannot be reduced. Contents of the invention [0003] The purpose of the present invention is to overcome the shortcomings of the above-mentioned prior art, and provide a heat dissipation structure of electronic dev...

AI Technical Summary

Problems solved by technology

[0002] Current electronic devices, such as wearable electronic devices, such as smart watches, have small structural space and small heat dissipation area, resulting in large heat generation and high temperature of the whole machine; if the commonly used graphite heat dissipation film is attached to the surface of the IC, the effect Limited; if metal materials such as copper foil are used to increase the heat dissipation area, the cost will increase and the thickness of the product cannot be reduced

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