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Electronic equipment, printed circuit board and preparation method of printed circuit board

A technology of printed circuit boards and substrates, which is applied in the direction of printed circuit manufacturing, printed circuits, printed circuits, etc., can solve the problems of increasing production, increasing the current carrying capacity of some areas, increasing the difficulty of welding processes, etc., achieving strong current carrying capacity and saving energy. The effect of simple and quick preparation cost and preparation method

Inactive Publication Date: 2016-07-06
GUANGDONG OPPO MOBILE TELECOMM CORP LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The technical problem to be solved by the present invention is to provide an electronic device, a printed circuit board and a preparation method thereof, aiming to solve the problem of increasing the difficulty of production and welding process or increasing the current carrying capacity of some areas of the printed circuit board in the prior art. The problem of increasing material costs

Method used

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  • Electronic equipment, printed circuit board and preparation method of printed circuit board
  • Electronic equipment, printed circuit board and preparation method of printed circuit board
  • Electronic equipment, printed circuit board and preparation method of printed circuit board

Examples

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Effect test

Embodiment 1

[0029] See figure 1 , is Embodiment 1 of the present invention, a printed circuit board, including a substrate 1 and a circuit layer 2, the circuit layer 2 has a large current area 21 and a small current area 22, the lines in the large current area 21 and the All pads are covered with a conductive layer 3 .

[0030] In this embodiment, the conductive layer 3 is a layer of copper foil.

[0031] In the printed circuit board of this embodiment, the lines and pads in the high current region 21 on the line layer 2 are covered with a layer of conductive layer 3 . Therefore, the lines and pads in the high-current region 21 have strong current carrying capacity, effectively ensuring the safety of the lines and electronic devices on the printed circuit board, and because there is no need to increase the width of the lines and pads, it is not necessary to It will reduce the space for placing electronic components on the PCB board.

[0032] See figure 2 , the preparation method of a...

Embodiment 2

[0038] See image 3 , is the second embodiment of the present invention, a printed circuit board, including a substrate 1 and a circuit layer 2, the circuit layer 2 has a large current area 21 and a small current area 22, the lines in the large current area 21 and All pads are covered with a conductive layer 3 .

[0039] Further, the printed circuit board of this embodiment also includes a first protective layer 51 and a second protective layer 52, and the first protective layer 51 covers the small current area 22, and the second protective layer 52 covers the conductive layer 3 . The top surface of the first protection layer 51 is flush with the top surface of the conductive layer 3 .

[0040] In this embodiment, the conductive layer 3 is a layer of copper foil produced by electroplating; the first protective layer 51 and the second protective layer 52 are ink layers (such as green oil layers), cover films or organic solder protection films, etc., so that the The lines and...

Embodiment 3

[0052] See Figure 5 , is the third embodiment of the present invention, a printed circuit board, including a substrate 1, the front and back sides of the substrate 1 are provided with a circuit layer 2, and the circuit layer 2 has a large current area 21 and a small current area 2 , the lines and pads in the high current region 21 are covered with a layer of conductive layer 3 .

[0053] Further, the printed circuit board of this embodiment also includes a first protection layer 51 and a second protection layer 52 disposed on each circuit layer, and the first protection layer 51 covers the small current area 22, and the second protection layer Layer 52 overlies conductive layer 3 . The top surface of the first protection layer 51 is flush with the top surface of the conductive layer 3 .

[0054] In this embodiment, the conductive layer 3 is a layer of copper foil produced by electroplating; the first protective layer 51 and the second protective layer 52 are an ink layer (s...

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Abstract

The invention is suitable for the technical field of printed circuit boards, and provides electronic equipment, a printed circuit board and a preparation method of the printed circuit board. The printed circuit board comprises a substrate and a line layer, wherein the line layer is provided with a high current region and a low current region; and a conductive layer covers a line in the high current region and a bonding pad. According to the printed circuit board provided by the invention, the line in the high current region and the bonding pad have relatively high current carrying capability; and the safety of the line and an electronic device on the printed circuit board is effectively ensured. Meanwhile, the preparation method of the printed circuit board is simple and fast; the conductive material with relatively high cost is utilized to the maximal extent; no unnecessary waste is generated; and compared with a traditional preparation method, the preparation method provided by the invention saves the preparation cost of the printed circuit board under the premise of ensuring that the printed circuit board has relatively high current carrying capability.

Description

technical field [0001] The invention belongs to the technical field of printed circuit boards, and in particular relates to an electronic device, a printed circuit board and a preparation method thereof. Background technique [0002] With the rapid development of electronic technology, the functions of electronic products are becoming more and more abundant. At the same time, with the increase of various functions, electronic devices such as functional modules and integrated circuits in electronic products are becoming more and more dense, which requires PCB boards to have higher current carrying capacity. [0003] The current carrying capacity of the PCB board depends on the following factors: line width, line thickness (copper foil thickness) and allowable temperature rise. At present, the copper foil thickness of most PCB boards is 35um, so the thickness of the copper foil is basically determined when the PCB board is designed. If the current carrying capacity of the lin...

Claims

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Application Information

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IPC IPC(8): H05K1/09H05K3/02H05K3/24
CPCH05K1/09H05K3/02H05K3/243H05K2201/0347
Inventor 赵文超
Owner GUANGDONG OPPO MOBILE TELECOMM CORP LTD