A semiconductor detector
A semiconductor and detector technology, applied in the field of detectors, can solve the problems affecting the energy resolution of CdZnTe semiconductor detectors, the fluctuation of output signal amplitude, etc., and achieve the effects of reducing the possibility, increasing the average electric field strength, and shortening the drift time
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0058] Such as figure 1 As shown, the semiconductor detector 100 provided in this embodiment includes a semiconductor crystal 101 , a cathode 102 , an anode 103 , a first step electrode 104 and a second step electrode 105 .
[0059] In this embodiment, the shape of the semiconductor crystal 101 is, for example, a cuboid. The material of the semiconductor crystal 101 includes HgI 2 , GaAs, TiBr, CdTe, CdZnTe, CdSe, GaP, HgS, PbI 2 or AlSb.
[0060] In this embodiment, the cathode 102 , the anode 103 , the first stepped electrode 104 and the second stepped electrode 105 are all conductive films deposited on the surface of the semiconductor crystal 101 . The materials of the cathode 102 , the anode 103 , the first stepped electrode 104 and the second stepped electrode 105 include Au, Pt, Ag, Cu, Al or ITO. The cathode 102 is disposed on the bottom surface 101 - 1 of the semiconductor crystal 101 and covers the entire area of the bottom surface 101 - 1 of the semiconductor c...
Embodiment 2
[0066] Such as image 3 As shown, the difference between the semiconductor detector 100 provided in this embodiment and Embodiment 1 is that the cathode 102 includes a plurality of rectangular sub-electrodes arranged on the bottom surface 101-1, and any two adjacent sub-electrodes are arranged between There is a gap, and the long side of each sub-electrode of the cathode 102 is parallel to the long side of the anode 103 . Each sub-electrode of the cathode 102 may be unevenly disposed on the bottom surface 101-1. Preferably, each sub-electrode of the cathode 102 is uniformly disposed on the bottom surface 101-1. The widths of the respective sub-electrodes of the cathode 102 may be different. Preferably, each sub-electrode of the cathode 102 has the same width. All the other are identical with embodiment 1.
Embodiment 3
[0068] Such as Figure 4As shown, the difference between the semiconductor detector 100 provided in this embodiment and Embodiment 1 is that the cathode 102 includes a plurality of rectangular sub-electrodes arranged on the bottom surface 101-1, and any two adjacent sub-electrodes are arranged between There is a gap, and the long side of each sub-electrode of the cathode 102 is perpendicular to the long side of the anode 103 . Each sub-electrode of the cathode 102 may be unevenly disposed on the bottom surface 101-1. Preferably, each sub-electrode of the cathode 102 is uniformly disposed on the bottom surface 101-1. The widths of the respective sub-electrodes of the cathode 102 may be different. Preferably, each sub-electrode of the cathode 102 has the same width. All the other are identical with embodiment 1.
PUM
Login to View More Abstract
Description
Claims
Application Information
Login to View More 


