Wafer position deviation detection and adjustment method and semiconductor processing equipment

Abstract

The invention provides a method for detecting and adjusting the wafer position deviation, and semiconductor processing equipment. The method comprises the steps of S1, defining a viewing zone at the boundary of a placement groove on the upper surface of a tray; S2, collecting the real-time image of the tray in the viewing zone, and conducing the gray-scale treatment on the real-time image based on the difference of the luminous reflectance between a wafer and the tray to obtain the positional information required for the calculation of the center deviation; S3, based on the positional information, conducting the further calculation to obtain the center deviation. According to the technical scheme of the invention, the position deviation of the wafer can be detected when the wafer is taken or placed by a manipulator. Therefore, the rotation angle of the tray and / or the displacement amount of the manipulator can be timely adjusted according to the position deviation of the wafer. As a result, the wafer is ensured to be accurately in place, so that the process yield is further improved.

Description

technical field [0001] The invention relates to the technical field of semiconductor processing, in particular to a method for detecting and adjusting wafer position deviation and semiconductor processing equipment. Background technique [0002] In the manufacturing process of semiconductor devices, the wafer is generally placed in a sealed and clean container or cassette, and the robot is used to automatically pick and place wafers between the container or cassette and the process chamber to prevent foreign particles from affecting the wafer. Wafer contamination. Moreover, a tray is usually provided in the process chamber, and the tray has a plurality of placement slots for placing wafers; and the tray is connected to a motor controller, and the motor controller is used to drive the tray to rotate at a certain angle. When performing the pick-and-place operation, firstly, under the control of the motor controller, the tray rotates at a certain angle so that one of the place...

AI Technical Summary

Problems solved by technology

However, the above-mentioned process of transferring wafers only relies on the control of the motor to ensure that the mechanical back and the tray are in place, and does not take any monitoring means to detect whether the manipulator and the tray in actual operation are really moving in place. Therefore, even if the wafer has a position deviation, It is also impossible to give feedback to the user in time, and once the position deviation of the wafer is too large, or even the phenomenon of "overlapping" (the edge of the wafer rests on the step formed by the placement groove and the upper surface of the tray), the wafer will often be scrapped, thereby affecting Process yield

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