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Testing machine for semiconductor packaging products

A semiconductor and detection machine technology, applied in semiconductor/solid-state device testing/measurement, semiconductor/solid-state device manufacturing, electrical components, etc., can solve problems such as low efficiency, a large number of workers, and low accuracy of product quality inspection, and achieve reduction Labor intensity, high detection efficiency, and accurate detection effect

Active Publication Date: 2016-07-20
刘媛媛
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, manual inspection has factors such as workers' work emotional state, work responsibility attitude, fatigue of the naked eye, confusion of the human eye itself to dense things, etc., resulting in a very low accuracy rate of product quality inspection, and the efficiency is not high.
In addition, manual inspection requires a large number of workers, which will cause a lot of unnecessary pollution to the clean room workshop and more personnel management and cost.

Method used

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  • Testing machine for semiconductor packaging products
  • Testing machine for semiconductor packaging products
  • Testing machine for semiconductor packaging products

Examples

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Embodiment Construction

[0039] It should be noted that, in the case of no conflict, the embodiments in the present application and the features in the embodiments can be combined with each other. The present invention will be further described below in conjunction with the accompanying drawings.

[0040] Such as Figure 1 to Figure 18As shown, a testing machine for semiconductor packaging products includes a frame 1, a testing mechanism 2, a feeding mechanism 3, a movable flow channel feeding mechanism 4, a feeding mechanism 5 and at least one set of fixed flow channel feeding mechanisms 6.

[0041] Such as figure 1 The frame 1 is divided into two parts, an upper housing 101 and a lower housing 102. The material of the lower housing 102 is Fe, and the surface is sprayed with white paint. The inside of the lower housing 102 supports the upper housing 101 through a skeleton. The lower shell 102 is separated from the upper shell 101 by a partition 103, and the material of the partition 103 is marble. ...

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PUM

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Abstract

The invention discloses a testing machine for semiconductor packaging products. The testing machine comprises a frame, a testing mechanism, a material loading mechanism, a movable channel accessing mechanism, a material discharging mechanism and at least one set of fixed channel material receiving mechanism, wherein the testing mechanism tests whether the products tested are qualified, the material loading mechanism supports a first material loading box, the movable channel accessing mechanism is in butt joint with the material loading mechanism and is used for clamping the products to be tested, the front end of the fixed channel material receiving mechanism is in butt joint with the tail part of the movable channel accessing mechanism, the fixed channel material receiving mechanism comprises two parallelly arranged second clamping plates, a material sucking assembly in butt joint with the tail part of the movable channel accessing mechanism, a second grabbing assembly and a second belt pulley assembly arranged on the downstream of the material sucking assembly, the material discharging mechanism supports a second material loading box which is used for containing tested products. The testing machine can rapidly and accurately test appearance defects of the products, and ensures high detection accuracy and efficiency. Labor intensity is reduced, labor force is saved, and the production cost is lowered.

Description

technical field [0001] The invention relates to testing equipment, in particular to a testing machine for semiconductor packaging products. Background technique [0002] Due to the miniaturization and precision of components at present, the requirements for the quality and yield of the product itself are constantly increasing, and the flow of defective products into the next process or the market has a great impact on the factory or the product itself. At present, the quality of products and the yield rate of inspection in these industries are all manually inspected by naked eyes through a microscope. In manual inspection, there are factors such as workers' work emotional state, work responsibility attitude, fatigue of naked eyes, and confusion of human eyes to dense things, which lead to very low accuracy and low efficiency of product quality inspection. Moreover, manual inspection requires a large number of workers, which will cause a lot of unnecessary pollution to the c...

Claims

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Application Information

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IPC IPC(8): H01L21/66H01L21/67
CPCH01L21/67005H01L22/12
Inventor 陈军付剑锋
Owner 刘媛媛
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