Loudspeaker diaphragm, manufacturing method thereof and moving coil type loudspeaker

A dynamic speaker and speaker technology, applied in the field of speakers, can solve the problems of poor bending resistance, easy breakage, and large weight and thickness of the conductive layer material of the metal coating layer, so as to achieve not easy to break, good bending resistance, light weight effect

Inactive Publication Date: 2016-07-20
GOERTEK INC
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  • Abstract
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  • Claims
  • Application Information

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Problems solved by technology

At present, the design of the conductive layer has the following two forms: 1) Use various metal foils and flexible circuit boards (FPC) as the conductive layer. The conductive layer design has good conductivity, but the weight and thickness of the conductive layer material are large. The performance and volume of loudspeaker products are greatly affected; 2) Metal coating is used as the conductive layer. This conductive layer design has the advantages of good conductivity, light weight, and thin thickness, but the metal coating layer has poor bending resistance and is easy to break

Method used

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  • Loudspeaker diaphragm, manufacturing method thereof and moving coil type loudspeaker
  • Loudspeaker diaphragm, manufacturing method thereof and moving coil type loudspeaker
  • Loudspeaker diaphragm, manufacturing method thereof and moving coil type loudspeaker

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Embodiment Construction

[0020] Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that the relative arrangements of components and steps, numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the present invention unless specifically stated otherwise.

[0021] The following description of at least one exemplary embodiment is merely illustrative in nature and in no way taken as limiting the invention, its application or uses.

[0022] Techniques, methods and devices known to those of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, such techniques, methods and devices should be considered part of the description.

[0023] In all examples shown and discussed herein, any specific values ​​should be construed as exemplary only, and not as limitations. Therefore, other instances of the exemplary embodiment may have dif...

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Abstract

The invention discloses a loudspeaker diaphragm which comprises a diaphragm body and a graphene film which is combined with one side surface of the diaphragm body and is used as a conductive layer. The invention further discloses a manufacturing method of the loudspeaker diaphragm, wherein the method comprises the steps of providing the diaphragm body, performing surface activation processing on the side surface of the diaphragm body; performing deposition on the side surface of the diaphragm body for forming the graphene film, thereby forming the loudspeaker diaphragm. The invention further discloses a moving coil type loudspeaker with the loudspeaker diaphragm. The loudspeaker diaphragm of the invention comprises the diaphragm body and the graphene film which is combined with the side surface of the diaphragm body. The loudspeaker diaphragm has advantages of high conductivity, small mass, small thickness, no easy breakage, etc.

Description

technical field [0001] The present invention relates to loudspeaker technology, and more specifically, to a loudspeaker diaphragm, a method for manufacturing a loudspeaker diaphragm, and a dynamic-coil loudspeaker. Background technique [0002] Compared with the ordinary power amplifier circuit, the smart power amplifier (SmartPA) adds the feedback of the speaker output signal, and the smart power amplifier intelligently adjusts the power according to the input audio signal and the feedback signal. With the application of smart power amplifier technology on speakers, more and more conductive designs need to be added to the vibration system of the speaker to achieve feedback on the output signal of the speaker. At present, the conductive layer design has the following two forms: 1) Use various metal foils and flexible circuit boards (FPC) as the conductive layer. This kind of conductive layer design has good conductivity, but the weight and thickness of the conductive layer m...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04R9/02H04R31/00H04R9/06
CPCH04R9/02H04R9/06H04R31/00
Inventor 郭晓冬王文海
Owner GOERTEK INC
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