A method of manufacturing a printed circuit board

A technology of printed circuit boards and manufacturing methods, which is applied in the direction of printed circuit manufacturing, printed circuits, printed circuits, etc., can solve the problems of unfavorable electrical connection reliability between inner and outer layers, difficulty in removing glass fibers, etc., to ensure the lamination effect, Effects of improving reliability and stabilizing dimensions

Active Publication Date: 2018-11-06
JIANGMEN SUNTAK CIRCUIT TECH
View PDF4 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The present invention aims at the problem that it is difficult to remove the glass fiber at the hole wall in the existing etch-back process for making the etch-out printed circuit board, which is not conducive to better improving the reliability of the electrical connection between the inner and outer layers, and provides a kind of etch-out effect that can be used. Manufacturing method of recessed printed circuit board for better improving electrical connection reliability between inner and outer layers

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A method of manufacturing a printed circuit board
  • A method of manufacturing a printed circuit board
  • A method of manufacturing a printed circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0021] This embodiment provides a method for manufacturing an etched printed circuit board. The etched printed circuit board includes metallized etch holes, and the metallized etch holes are formed by metallizing the etch holes. The etch-back hole is formed after the through-hole is etched back.

[0022] The specific production steps are as follows:

[0023] (1) Making the inner core board

[0024] First, the base material is cut to obtain a core board of a predetermined size. Then bake the board, that is, place the core board at 150-175° C. to bake the core board for 4 hours. Next, according to the prior art, the inner layer circuit is made on the core board through the negative process to obtain the inner layer core board.

[0025] (2) Drill preset holes

[0026] Drill preset holes on the prepreg, the drilled preset holes correspond to the through holes to be made in the subsequent process and the center of the preset hole overlaps with the center of the through hole; in...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention relates to the technical field of circuit board production, in particular to a method for manufacturing a recessed printed circuit board. The present invention firstly drills preset holes on the prepreg that are one-to-one corresponding to the through holes and whose aperture is larger than the through holes, thereby removing the corresponding glass fiber cloth on the subsequent through holes that need to be etched back in advance. It only needs to remove the resin in the hole, which solves the problem that it is difficult to remove the glass fiber cloth, and can form a good effect of etch and hole wall, so that the inner layer copper can be fully exposed, and the hole wall is plated with copper after the through hole is metallized A three-dimensional connection can be formed with the copper of the inner layer, making the connection between the two stronger, thereby improving the reliability of the electrical connection between the inner and outer layers. The aperture of the preset hole is set to be 0.05mm larger than the aperture of the through hole, which can fully remove the glass fiber cloth without causing the prepreg to lose too much resin, reducing the impact of the prepreg on the lamination caused by the loss of resin due to drilling.

Description

technical field [0001] The invention relates to the technical field of printed circuit board production, in particular to a method for manufacturing a recessed printed circuit board. Background technique [0002] Printed Circuit Board (PCB) is also called printed circuit board. With the development of technology, higher and higher requirements are put forward for the precision and reliability of printed circuit boards. In order to improve the high reliability of the electrical connection between the inner and outer layers of the (multi-layer) printed circuit board, a certain amount of resin and glass fiber on the hole wall can be removed after drilling to completely expose the inner layer copper at the hole wall After sinking copper and electroplating the whole plate to metallize the hole wall, a three-dimensional connection is formed between the copper plating layer on the hole wall and the inner line copper, which makes the connection between the two stronger, thereby imp...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/00H05K3/42
CPCH05K3/0047H05K3/429H05K2201/09563
Inventor 敖四超寻瑞平张义兵钟宇玲
Owner JIANGMEN SUNTAK CIRCUIT TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap