A method of manufacturing a printed circuit board
A technology of printed circuit boards and manufacturing methods, which is applied in the direction of printed circuit manufacturing, printed circuits, printed circuits, etc., can solve the problems of unfavorable electrical connection reliability between inner and outer layers, difficulty in removing glass fibers, etc., to ensure the lamination effect, Effects of improving reliability and stabilizing dimensions
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[0021] This embodiment provides a method for manufacturing an etched printed circuit board. The etched printed circuit board includes metallized etch holes, and the metallized etch holes are formed by metallizing the etch holes. The etch-back hole is formed after the through-hole is etched back.
[0022] The specific production steps are as follows:
[0023] (1) Making the inner core board
[0024] First, the base material is cut to obtain a core board of a predetermined size. Then bake the board, that is, place the core board at 150-175° C. to bake the core board for 4 hours. Next, according to the prior art, the inner layer circuit is made on the core board through the negative process to obtain the inner layer core board.
[0025] (2) Drill preset holes
[0026] Drill preset holes on the prepreg, the drilled preset holes correspond to the through holes to be made in the subsequent process and the center of the preset hole overlaps with the center of the through hole; in...
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