A split heating platform for cavity in-line metal packaging

Abstract

The invention discloses a split type heating platform used for cavity direct-insertion type metallic packaging. The split type heating platform comprises a middle combined frame, a heat conduction module positioned in the middle combined framework, and a heating base positioned at the bottom of the middle combined frame and used for heating the heat conduction module. The split type heating platform provided by the invention is high in structural universality; due to the combinations of heat conduction strips of different widths and wedge-shaped insertion blocks, the heating requirements of cavity direct-insertion type circuits of different sizes can be satisfied; one set of die can be matched with production placement positions of different spans, so that the heating requirement of the cavity direct-insertion type electronic products of different sizes can be satisfied separately; and in addition, the split type heating platform can realize effective avoidance to packaging pins, and is high in heat conduction efficiency, and flexible in operation.

Description

technical field [0001] The invention belongs to the technical field of integrated circuit packaging, and relates to a heating platform for preheating and keeping warm products during the production process of cavity in-line metal package electronic products, in particular to a split heating for cavity in-line metal package tower. Background technique [0002] The commonly used constant temperature heating table is mainly flat plate structure, which is processed by aluminum alloy. Aluminum alloy has the characteristics of fast heating, uniform heating and not easy to oxidize. In order to realize the heating of cavity-in-line metal-encapsulated electronic products, it is necessary to reprocess the flat structure, such as making the table top into a wire slot structure. In the integrated circuit packaging and testing industry, in the production process, it is often necessary to use a heating table to preheat or keep the integrated circuit warm. The packaging form of the integ...

AI Technical Summary

Problems solved by technology

According to the specifications of lead wire spacing and wire diameter of cavity in-line metal package, wire slots of corresponding size are processed on the heating table. Significantly increase the cost of mold development, and may also affect the production schedule

Due to the narrow and deep structure of the machined wire groove, when it is contaminated by foreign matter, it is quite laborious to clean up

The main disadvantages of the existing wire trough structure heating table are: 1. Due to the variety of product sizes, the amount of development is greatly increased, and repeated development causes a lot of waste of cost; 2. The integral module is not easy to disassemble and clean; 3. The mold cannot be timely when new products are launched Supplement is in place; 4. It is inconvenient to replace the table top, and the heating unit needs to be disassembled; 5. The heat transfer efficiency is low; When there are many varieties, the development cost will also increase significantly

However, due to the different lead diameters and pitches of different cavity in-line metal packages, some products often have pins that cannot be properly embedded in the groove due to size differences, resulting in problems such as Figure 3 shows the matching fault, one row of pins of the product is embedded in the slot, and the other row of pins foot lap on tooth surface

[0003] The present invention aims to solve the following problems: 1. The universality of the heating table for various sizes of cavities in-line metal packaging electronic products; 2. Solve repeated development A lot of cost waste caused by the mold; 3. Solve the problem that the heating table is not easy to disassemble and clean when it is contaminated; 4. Provide an effective heating table plan for the production of new products on the production line

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