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Chip operating state monitoring system and monitoring method

A technology for monitoring system and operating status, which is applied in the field of chip operating status monitoring system, can solve problems such as large area, and achieve the effects of accurate identification, reduced process changes, and reduced area

Active Publication Date: 2018-11-16
SEMICON MFG INT (SHANGHAI) CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, the occupied area of ​​the monitoring system based on the PVT sensor is relatively large

Method used

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  • Chip operating state monitoring system and monitoring method
  • Chip operating state monitoring system and monitoring method
  • Chip operating state monitoring system and monitoring method

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Experimental program
Comparison scheme
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Embodiment Construction

[0037] It can be seen from the background art that the existing monitoring system for chip running status has the problem of occupying a large area. combine figure 1 Causes of analysis problems for the monitoring system shown:

[0038] In the monitoring system of the prior art, the voltage sensor and the temperature sensor in the PVT sensor both include analog-to-digital converters, so the areas of the voltage sensor and the temperature sensor are relatively large. Moreover, the PVT sensor includes three sensors to monitor the process, voltage and temperature of the chip during operation, so the existing chip monitoring system has a large area.

[0039]In addition, in the identification process of the existing PVT sensor, the identification standard adopted is the range of voltage and temperature stored in the memory. These identification standards are unified standards for all blocks in the chip, rather than specific standards for associated blocks. , so the existing PVT se...

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Abstract

The invention provides a chip operation state monitoring system and monitoring method. The monitoring system comprises a temperature frequency sensor for sensing the chip temperature of an associated block and outputting the test frequency capable of reflecting the operation speed of the device in the associated block, a memory for storing multiple working temperatures and the frequency ranges corresponding to each working temperature, an identifier which is used for judging whether the chip temperature sensed by the temperature frequency sensor is the working temperature stored in the memory and judging whether the testing frequency outputted by the temperature frequency sensor is in the frequency range corresponding to the working temperature when the chip temperature is the working temperature. According to the invention, by using the relations between the inverter ring oscillator output power and chip operation process, voltage and temperature, the temperature frequency sensor is used to realize the functions of process, voltage and temperature sensors in the prior art, and the area of the chip monitoring system is reduced.

Description

technical field [0001] The invention relates to the field of chip design, in particular to a chip operating state monitoring system and a monitoring method. Background technique [0002] The performance of semiconductor devices is prone to change with changes in usage conditions and surrounding environments. For example, performance characteristics such as threshold voltage, saturation current, and leakage current of a semiconductor device will generally change with changes in voltage and ambient temperature when the device is used. [0003] In the existing system on chip (System on Chip, SoC) design, a chip monitoring system is generally used to monitor the state of the chip. refer to figure 1 , shows a schematic diagram of a monitoring system in the prior art. The monitoring system is a process, voltage, and temperature sensor 100 (Process / Voltage / Temperature Sensor, PVT sensor) monitoring system, including: a process sensor 110, which is used to sense the process opera...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01R31/26
Inventor 杨家奇
Owner SEMICON MFG INT (SHANGHAI) CORP