Mounting device and chuck inclination inspection method of mounting device
A technology of placement device and inspection method, which is applied in the manufacturing of electrical components, circuits, semiconductor/solid-state devices, etc., to achieve the effect of improving processing capacity
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Embodiment 1
[0068] figure 1 It is a schematic plan view of a die bonder 10 , which is a device for mounting semiconductor components, which is an embodiment of a mounting device which is an object of the present invention. in addition, figure 2 This is a side view of chip pick-up and placement. refer to the figure 1 and figure 2 The main components of the die bonder will be explained.
[0069] The die bonder 10 generally includes: a chip supply unit 1 that supplies chips D to be mounted on a substrate P; a pick-up unit 2 that picks up chips from the chip supply unit 1; The intermediate stage of the chip D picked up; the mounting part 4, which picks up the chip D of the intermediate stage part 3, and mounts it on the substrate P or the mounted chip; the conveying part 5, which conveys the substrate P to the mounting Position; preforming part 6, which is a part that attaches a substance called paste (paste) on the substrate to the substrate on the conveying part 5; substrate supply p...
Embodiment 2
[0106] Hereinafter, Example 2 will be described. In Example 2, the position where the protrusion X is provided according to the present invention is different from that in Example 1. The portion where the protrusion X is provided may be any position as long as it is a position where the chuck 22 or the chuck 42 can contact. In the first embodiment described above, the case where the protrusion X is provided on the intermediate stage portion 3 and the mounting portion 4 has been described. In addition, as Figure 10 As shown, it can be around the pick-up unit 1, the part between the pick-up unit 1 and the intermediate stage part 3, the part between the intermediate stage part 3 and the mounting table of the conveying part 5, and the surrounding area of the mounting table of the conveying part 5. parts. Figure 10 The reference sign X1 in the above indicates the protrusion X provided on the periphery of the pick-up part 1, the reference sign X2 indicates the protrusion X pr...
Embodiment 3
[0111] In Example 1, the case where the number of positions contacting the protrusion X in the chuck was four was described. This for example Figure 7 (a) shown. Here, a circle 701 indicates a position where the protrusion X contacts. The difference between Example 3 and Example 1 lies in the case where there are six contact positions. In this case, if Figure 7 As shown in (b), in addition to the corners (circle 701 ) of the four corners of the chuck 700 , the position of the center of the long side (circle 702 ) can also be shown as the measurement position. By contacting at multiple positions in this way, even in the case where the surface of the chuck is uneven to match the shape of the chip, etc., it is possible to touch the protrusion X at multiple positions and detect the inclination of the chuck . Thereby, the reliability of detection of the inclination of a chuck can be further improved.
[0112] In addition, when a plurality of positions in the chuck come into...
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