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Barrier films and vacuum insulated panels employing same

A technology of vacuum heat insulation board and barrier film, applied in the direction of vacuum evaporation coating, pipeline protection through heat insulation, application, etc., can solve the problems of reducing VIP thermal insulation performance, failing to meet VIP barrier requirements, low thermal conductivity, etc.

Active Publication Date: 2016-08-03
3M INNOVATIVE PROPERTIES CO
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the high thermal conductivity of the metal foil reduces the overall thermal insulation performance of the VIP due to thermal bridging effects
On the other hand, metallized polymer substrates, such as those used in food-grade packaging films, have low thermal conductivity but do not meet the barrier requirements of VIP

Method used

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  • Barrier films and vacuum insulated panels employing same
  • Barrier films and vacuum insulated panels employing same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach A

[0051] Embodiment A. An article comprising a vacuum insulation panel cladding comprising:

[0052] (a) a substrate having two opposing major surfaces;

[0053] (b) a first layer in direct contact with one of the opposing major surfaces of the substrate, wherein the first layer is a low thermal conductivity organic layer or a low thermal conductivity inorganic laminate;

[0054] (c) A second layer in direct contact with the first layer, wherein the second layer is a low thermal conductivity organic layer or a low thermal conductivity inorganic laminate, and wherein the second layer is of a different material than the first layer.

[0055] Embodiment B. The article of embodiment A, wherein the low thermal conductivity inorganic stack comprises a low thermal conductivity non-metallic inorganic material.

[0056] Embodiment C. The article according to embodiments A through B, wherein the low thermal conductivity inorganic stack comprises a low thermal conductivity metallic mat...

Embodiment approach F

[0059] Embodiment F. The article according to any one of the preceding embodiments, further comprising an additional low thermal conductivity organic layer.

Embodiment approach G

[0060] Embodiment G. The article according to any one of the preceding embodiments, further comprising a heat seal layer.

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Abstract

There is provided a vacuum insulation panel envelope having a substrate, a low thermal conductivity organic layer and a low thermal conductivity inorganic stack. The low thermal conductivity inorganic stack will include low thermal conductivity non-metallic inorganic materials and / or low thermal conductivity metallic materials.

Description

technical field [0001] The present disclosure relates to durable barrier films. The present disclosure also provides vacuum insulation panels employing these barrier films. Background technique [0002] Vacuum insulation panels (VIP) are a form of insulation consisting of a substantially airtight envelope surrounding a core from which air has been evacuated. It is used, for example, in electrical appliances and building construction to provide better thermal insulation than conventional insulation materials. Because air leakage into the cladding ultimately reduces the thermal insulation value of the VIP, known designs use a metal foil laminated with a heat-sealable material as the cladding to provide gas barrier properties. However, the high thermal conductivity of the metal foil reduces the overall thermal insulation performance of the VIP due to thermal bridging effects. On the other hand, metallized polymer substrates, such as those used in food-grade packaging films, ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): E04B1/80B32B33/00
CPCE04B1/803B32B37/16B32B38/0008B32B2607/00Y02A30/242Y02B80/10F16L59/029F16L59/065C23C14/081C23C14/10C23C14/205C23C14/34E04B1/80E04B1/942E04B2001/7679E04C2/296
Inventor 克里斯托弗·S·莱昂斯唐娜·W·班格赛德利克·贝多亚保莱·T·恩根彼得·B·赫格顿约瑟夫·M·皮珀艾米·普雷斯勒普林斯余大华聂其红唐纳德·J·穆克卢尔
Owner 3M INNOVATIVE PROPERTIES CO