Barrier films and vacuum insulated panels employing same
A technology of vacuum heat insulation board and barrier film, applied in the direction of vacuum evaporation coating, pipeline protection through heat insulation, application, etc., can solve the problems of reducing VIP thermal insulation performance, failing to meet VIP barrier requirements, low thermal conductivity, etc.
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Embodiment approach A
[0051] Embodiment A. An article comprising a vacuum insulation panel cladding comprising:
[0052] (a) a substrate having two opposing major surfaces;
[0053] (b) a first layer in direct contact with one of the opposing major surfaces of the substrate, wherein the first layer is a low thermal conductivity organic layer or a low thermal conductivity inorganic laminate;
[0054] (c) A second layer in direct contact with the first layer, wherein the second layer is a low thermal conductivity organic layer or a low thermal conductivity inorganic laminate, and wherein the second layer is of a different material than the first layer.
[0055] Embodiment B. The article of embodiment A, wherein the low thermal conductivity inorganic stack comprises a low thermal conductivity non-metallic inorganic material.
[0056] Embodiment C. The article according to embodiments A through B, wherein the low thermal conductivity inorganic stack comprises a low thermal conductivity metallic mat...
Embodiment approach F
[0059] Embodiment F. The article according to any one of the preceding embodiments, further comprising an additional low thermal conductivity organic layer.
Embodiment approach G
[0060] Embodiment G. The article according to any one of the preceding embodiments, further comprising a heat seal layer.
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Abstract
Description
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Application Information
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