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High-precision three-dimensional processing lifting platform

A lifting platform, high-precision technology, used in metal processing equipment, manufacturing tools, auxiliary devices, etc., can solve problems such as poor applicability and inability to three-dimensional processing

Active Publication Date: 2017-12-01
SHENZHEN HOYAN LASER TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The technical problem to be solved by the present invention is to provide a high-precision three-dimensional processing lifting platform, which aims to solve the defects in the prior art that only plane processing of products can be performed but not three-dimensional processing, and the applicability is poor

Method used

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  • High-precision three-dimensional processing lifting platform

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Embodiment Construction

[0027] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0028] The high-precision three-dimensional processing lifting platform provided by the embodiment of the present invention includes a platform substrate for carrying products to be processed and at least two lifting devices for adjusting the height and plane inclination of the platform substrate; each lifting device includes a lead The fixed plate installed vertically, the slide rail fixed on the inner side of the fixed plate and extending in the direction perpendicular to the horizontal plane, the connecting plate whose outer end slides on the slide rail and the d...

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Abstract

The invention relates to the technical field of laser cutting, and provides a high-precision three-dimensional processing lifting platform, which includes a platform substrate for carrying products to be processed and at least two lifting devices for adjusting the height and plane inclination of the platform substrate; each Each lifting device includes a vertically arranged fixed plate, a slide rail fixed on the inner side of the fixed plate and extending in a direction perpendicular to the horizontal plane, a connecting plate whose outer end is slidably arranged on the slide rail, and a driving connecting plate on the slide rail. Relatively moving drive mechanism, the inner end of the slide rail is movably connected with the edge of the bottom surface of the platform substrate; a limiting structure is provided between each connecting plate and the edge of the platform substrate to prevent the two from detaching. Compared with the prior art, the high-precision three-dimensional processing lifting platform provided by the present invention can not only carry out planar processing of the product to be processed, but also carry out three-dimensional processing.

Description

technical field [0001] The invention relates to the technical field of laser cutting, in particular to a high-precision three-dimensional processing lifting platform. Background technique [0002] Laser cutting is the energy released when the laser beam is irradiated on the surface of the workpiece to melt and evaporate the workpiece to achieve the purpose of cutting and engraving. It has high precision, fast cutting, not limited to the limitation of cutting patterns, automatic typesetting saves materials, and the cut is smooth. , low processing cost and other characteristics, will gradually improve or replace traditional metal cutting process equipment. [0003] At present, the existing laser cutting equipment includes laser power supply, laser oscillator, refracting mirror, cutting torch, cutting work platform, cutting torch driving device, numerical control device, operation panel, gas cylinder, cooling water circulation device and air dryer. Among them, the cutting work...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K26/70B23K37/04B23K37/047
Inventor 陈远生
Owner SHENZHEN HOYAN LASER TECH CO LTD
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