Low-temperature, heat-sealing and inflation-resistant CPP aluminum-plated film and preparation method thereof

A low-temperature heat-sealing and aluminized film technology, applied in chemical instruments and methods, flexible coverings, packaging, etc., can solve the problems of poor toughness, heat-sealing strength (weak barrier property, etc.), and achieve improved production efficiency and long-term quality The effect of guaranteeing and improving the speed of the aircraft package

Active Publication Date: 2016-08-17
HUBEI DEWEI PACKAGING TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The temperature of the heat-sealing layer of the existing aluminized film is high, the heat-sealing strength (barrier property) is still weak, and the toughness is poor

Method used

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  • Low-temperature, heat-sealing and inflation-resistant CPP aluminum-plated film and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] Such as figure 1 As shown, a low-temperature heat-sealable air-resistant CPP aluminized film is formed by four-layer co-extrusion of a heat-sealed layer, a first core layer, a second core layer, and an aluminized layer; the heat-sealed layer, the first core layer, the second core layer, and the aluminum plating layer are respectively: 19%, 29%, 34%, and 18%;

[0030] The material of the heat-sealing layer is formed by mixing ternary random copolymerized polypropylene (PP) resin, ethylene-vinyl acetate copolymer (EVA) and a modifier, and the mass percentages of each raw material are respectively: Standard copolymer polypropylene (PP) resin 40%, ethylene-vinyl acetate copolymer (EVA) 40%, modifier 20%;

[0031] The material of the first core layer is formed by mixing polypropylene resin and metallocene polyethylene (linear), and the mass percentages of each raw material are: polypropylene resin 65%, metallocene polyethylene 35%;

[0032] The material of the second core ...

Embodiment 2

[0047] Such as figure 1 As shown, a low-temperature heat-sealable air-resistant CPP aluminized film is formed by four-layer co-extrusion of a heat-sealed layer, a first core layer, a second core layer, and an aluminized layer; the heat-sealed layer, the first core layer, the second core layer, and the aluminum plating layer account for the mass percentages of 20%, 28%, 34%, and 18% respectively;

[0048] The material of the heat-sealing layer is formed by mixing ternary random copolymerized polypropylene (PP) resin, ethylene-vinyl acetate copolymer (EVA) and a modifier, and the mass percentages of each raw material are respectively: Regular copolymerized polypropylene (PP) resin 45%, ethylene-vinyl acetate copolymer (EVA) 45%, modifier 10%;

[0049] The material of the first core layer is formed by mixing polypropylene resin and metallocene polyethylene (linear), and the mass percentages of each raw material are: polypropylene resin 70%, metallocene polyethylene 30%;

[0050...

Embodiment 3

[0065] Such as figure 1 As shown, a low-temperature heat-sealable air-resistant CPP aluminized film is formed by four-layer co-extrusion of a heat-sealed layer, a first core layer, a second core layer, and an aluminized layer; the heat-sealed Layer, the first core layer, the second core layer, and the aluminum plating layer account for the mass percentages: 20%, 29%, 33%, and 18% respectively;

[0066] The material of the heat-sealing layer is formed by mixing ternary random copolymerized polypropylene (PP) resin, ethylene-vinyl acetate copolymer (EVA) and a modifier, and the mass percentages of each raw material are respectively: Regular copolymerized polypropylene (PP) resin 50%, ethylene-vinyl acetate copolymer (EVA) 40%, modifier 10%;

[0067] The material of the first core layer is formed by mixing polypropylene resin and metallocene polyethylene (linear), and the mass percentages of each raw material are: polypropylene resin 75%, metallocene polyethylene 25%;

[0068] ...

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Abstract

The invention belongs to the technical field of aluminum-plated films and provides a low-temperature, heat-sealing and inflation-resistant CPP aluminum-plated film. The invention is characterized in that, the low-temperature, heat-sealing and inflation-resistant CPP aluminum-plated film is formed through the co-extrusion process of four layers, namely a heat-sealing layer, a first core layer, a second core layer and an aluminum-plated layer, wherein the four layers are sequentially arranged and casted. The mass percentages of the heat-sealing layer, the first core layer, the second core layer and the aluminum-plated layer are respectively 19-20%, 28-29%, 33-34%, and 17-18%. The heat-sealing layer is prepared through mixing up ternary random copolymer polypropylene resin, ethylene-vinyl acetate copolymer (EVA) and a modifying agent. The first core layer is prepared through mixing up polypropylene resin and metallocene polyethylene. The second core layer is prepared through mixing up polypropylene resin, polyamide resin and low-density polyethylene. The aluminum-plated layer is prepared through mixing up copolymer resin and a reinforcing agent. An aluminum-plated film prepared through the above method is good in toughness, and the temperature of the heat-sealing layer can be reduced.

Description

technical field [0001] The invention belongs to the technical field of aluminized films, and in particular relates to a low-temperature heat-sealable air-resistant CPP aluminized film and a preparation method thereof. Background technique [0002] The temperature of the heat-sealing layer of the existing aluminized film is high, the heat-sealing strength (barrier property) is relatively weak, and the toughness is poor. Contents of the invention [0003] The object of the present invention is to provide a low-temperature heat-sealing air-resistant CPP aluminized film and a preparation method thereof. The aluminized film prepared by the method has good toughness and can reduce the temperature of the heat-sealing layer. [0004] In order to achieve the above object, the technical solution adopted by the present invention is: a low-temperature heat-sealable air-resistant CPP aluminized film, which is characterized in that it consists of a heat-sealing layer, a first core layer...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B27/32B32B27/30B32B27/18B32B27/06B32B27/08B32B33/00B65D65/40C08L23/14C08L23/08C08L23/12C08L23/06C08L77/06
CPCB65D65/40C08L23/06C08L23/0853C08L23/12C08L23/14B32B27/08B32B27/18B32B27/306B32B27/32B32B27/327B32B33/00B32B2307/558C08L2205/03C08L2205/025C08L2205/02C08L2203/16C08L2207/066C08L77/06C08K5/20
Inventor 蔡岩胜蔡扬龙刘桂华
Owner HUBEI DEWEI PACKAGING TECH
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