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Photosensitive resin for solid materials and preparation method thereof

A photosensitive resin, solid technology, applied in the field of photosensitive resin, can solve the problems of light-curing 3D printing technology limitations, etc., to strengthen the model details, meet the needs of use, and reduce costs.

Inactive Publication Date: 2016-08-17
JIANGSU DUNCHAO ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The current inkjet UV curing molding process for 3D printing is to spray the photosensitive resin that can be UV cured by inkjet method, cure it by UV light irradiation, and then stack it layer by layer to form the required model. Photosensitive resins are resins that obtain a certain structural strength after being cured by UV irradiation, and are divided into solid materials and support materials. At present, there is no such photosensitive resin for solid materials that meets the requirements in my country, and they are all monopolized by foreign countries. 3D printing technology is very limited

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022] Embodiment 1, a photosensitive resin used for solid materials, its raw materials are composed of the following components in terms of weight percentage:

[0023] Oligomer 30-60%;

[0024] Monomer 20-40;

[0025] Photoinitiator 2%;

[0026] Thinner 10-20%;

[0027] Defoamer 0.1-4%;

[0028] Leveling agent 0.1-4%;

[0029] Nanoscale silica 1-5%.

[0030] To prepare the photosensitive resin used for solid materials in this example, the photoinitiator used is 2%. The prepared photosensitive resin has reached the performance index of foreign products in the test results of the photocurable 3D printer.

Embodiment 2

[0031] Embodiment 2, a photosensitive resin used for solid materials, its raw materials are composed of the following components in terms of weight percentage:

[0032] Oligomer 30-60%;

[0033] Monomer 20-40;

[0034] Photoinitiator 3%;

[0035] Thinner 10-20%;

[0036] Defoamer 0.1-4%;

[0037] Leveling agent 0.1-4%;

[0038] Nanoscale silica 1-5%.

[0039] To prepare the photosensitive resin used for solid materials in this example, the photoinitiator used is 3%, and the prepared photosensitive resin has reached the performance index of foreign products in the test results of the photocurable 3D printer.

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PUM

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Abstract

The invention discloses a photosensitive resin for solid materials and a preparation method thereof. The photosensitive resin for solid materials is composed of the following components in percentage by weight: 30-60% of low polymer, 20-40% of monomer, 1-10% of photoinitiator, 10-20% of diluter, 0.1-4% of defoaming agent, 0.1-4% of leveling agent and 0.1-5% of nano silicon dioxide. The preparation method comprises the following steps: (1) proportionally preparing raw materials; and (2) uniformly mixing the components to prepare the photosensitive resin material for solid material printing, wherein the viscosity of the photosensitive resin material is 20-30cp. The photosensitive resin for solid materials is a precedent in China. Compared with like products abroad, on the premise of ensuring various properties, the cost is greatly lowered, the physical mechanical properties of the solid model are enhanced, and the photosensitive resin can be used for manufacturing molds for producing small-batch molding part products, thereby satisfying the use demands of more users at home and abroad.

Description

technical field [0001] The invention relates to a photosensitive resin that can be used for solid materials, and more specifically relates to a photosensitive resin for solid materials of a photocurable 3D printer, which belongs to the technical field of photocurable materials. Background technique [0002] The current inkjet UV curing molding process for 3D printing is to spray the photosensitive resin that can be UV cured by inkjet method, cure it by UV light irradiation, and then stack it layer by layer to form the required model. Photosensitive resins are resins that obtain a certain structural strength after being cured by UV irradiation, and are divided into solid materials and support materials. At present, there is no such photosensitive resin for solid materials that meets the requirements in my country, and they are all monopolized by foreign countries. 3D printing technology is very limited. Contents of the invention [0003] The object of the present invention i...

Claims

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Application Information

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IPC IPC(8): C08F220/28C08F220/34C08F220/18C08F222/14C08F220/20C08F2/48C08K3/36
CPCC08F2/48C08F220/18C08F220/28C08F220/281C08F220/285C08F220/34C08F220/343C08F222/14C08F222/145C08K3/36C08K2201/011C08F220/20
Inventor 曾皖生乔羽
Owner JIANGSU DUNCHAO ELECTRONICS CO LTD