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A kind of silicon-free heat conduction gasket and preparation method thereof

A technology for thermally conductive gaskets and thermally conductive powders, applied in chemical instruments and methods, materials for heat exchange, etc., can solve the problems of high production cost, shortened life of thermally conductive gaskets, insufficient preparation materials and preparation processes, and achieve production efficiency. High quality, long service life, and high-quality finished products

Active Publication Date: 2018-02-23
杭州兆科电子材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] With the advancement of science and technology, the use of electronic equipment is increasing, and the parts with airtight functions required under high temperature conditions also increase accordingly. Most of the thermal pads in the prior art contain silicon, and the silicon-containing pads Silicone oil seeps out under heat and pressure between components, shortening the life of the thermal pad
[0003] However, the silicone-free thermal pads on the market are relatively expensive due to their imperfect preparation materials and processes. Therefore, a silicone-free thermal pad that completely inherits the advantages of silicone thermal pads does not leak oil, and its preparation cost is lower than that of the market. Silicone-free thermal pads with low preparation costs can fill this gap

Method used

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  • A kind of silicon-free heat conduction gasket and preparation method thereof

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Effect test

preparation example Construction

[0014] The invention provides a method for preparing a silicon-free thermal pad, the main steps of which include:

[0015] Weigh the first raw material and the second raw material for preparing the silicon-free thermal pad for later use. In parts by weight, the first raw material includes: 100 parts of liquid acrylic rubber, 100 to 1000 parts of thermal conductive powder, (2-(2 - 10-40 parts of butoxyethoxy) ethyl) ester; the second raw material includes 0.1-1 part of vulcanizing agent by weight; knead and stir the first raw material in vacuum at 150-180 °C for 2-6 hours , and then mix the first raw material and the second raw material after vacuum kneading and stirring, and then stir for 4 to 40 minutes to obtain a rubber compound, put the rubber compound into a mold and hot press vulcanize under vacuum conditions at 130 to 160 ° C for 4 to 15 minutes, then cool to get the finished product. , the liquid acrylate rubber includes at least one of liquid acrylate rubber, liquid ...

Embodiment 1

[0023] The preparation method of a silicon-free thermal pad provided in this embodiment, the specific operation steps are:

[0024] Step A, the raw materials for the preparation of silicon-free thermal pads: 100 parts of liquid acrylic resin, 400 parts of alumina powder, 10 parts of (2-(2-butoxyethoxy) ethyl) ester, 4,4 1.8 parts of '-bis(α,α-dimethylbenzyl)diphenylamine, 0.1 part of yellow iron oxide, 0.3 part of organotin, and 0.15 part of isocyanate were weighed for later use.

[0025] Step B, 100 parts of liquid acrylic resin, 400 parts of alumina powder, 10 parts of (2-(2-butoxyethoxy) ethyl) ester, 4,4' - Add 1.8 parts of bis(α,α-dimethylbenzyl)diphenylamine and 0.1 part of iron oxide yellow into a high-temperature vacuum kneading mixer and stir at 180° C. for 2 hours.

[0026] Step C, add 0.3 parts of organotin and 0.15 parts of isocyanate when cooled to 100°C, and stir for 15 minutes with a double planetary mixer to obtain a rubber compound.

[0027] Step D: Pour the...

Embodiment 2

[0030] The preparation method of a silicon-free thermal pad provided in this embodiment, the specific operation steps are:

[0031] Step A, the raw materials for the preparation of silicon-free thermal pads: 100 parts of liquid acrylic resin, 500 parts of alumina powder, 20 parts of (2-(2-butoxyethoxy) ethyl) ester, 4,4 1.8 parts of '-bis(α,α-dimethylbenzyl) diphenylamine, 0.1 part of carbon black, 0.25 parts of organotin, and 0.13 parts of isocyanate were weighed for later use.

[0032] Step B, 100 parts of liquid acrylic resin, 500 parts of alumina powder, 20 parts of (2-(2-butoxyethoxy) ethyl) ester, 4,4' - Add 1.8 parts of bis(α,α-dimethylbenzyl)diphenylamine and 0.1 part of carbon black into a high-temperature vacuum kneading mixer and stir at 175° C. for 4 hours.

[0033] Step C, when cooling to 100°C, add 0.25 parts of organotin and 0.13 parts of isocyanate, and stir for 15 minutes with a double planetary mixer to obtain a rubber compound.

[0034] Step D: Pour the ob...

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Abstract

The invention provides a preparation method of a silicon-free heat-conducting gasket. The preparation method comprises the following main steps: weighing a first raw material and a second raw material for preparing the silicon-free heat-conducting gasket for later use; carrying out vacuum kneading and stirring on the first raw material at 150-180 DEG C for 2-6 hours; mixing the first raw material subjected to vacuum kneading and stirring with the second raw material and stirring the mixture for 4-40 minutes, thus obtaining a rubber compound; putting the rubber compound in a mold; carrying out hot pressed vulcanization on the mold to which the rubber compound is added under the vacuum condition of 130-160 DEG C for 4-15 minutes; cooling the product, thus obtaining the finished product. The preparation method of the silicon-free heat-conducting gasket has the advantages of simplicity in operation, high production efficiency, high quality of the produced finished product, low defective rate and low manpower cost. The silicon-free heat-conducting gasket prepared by the method has the characteristics that the silicon-free heat-conducting gasket has good heat-conducting property and does not yield oil in the extreme environment.

Description

technical field [0001] The invention relates to the field of heat conduction pads, and in particular to a silicon-free heat conduction pad and a preparation method thereof. Background technique [0002] With the advancement of science and technology, the use of electronic equipment is increasing, and the parts with airtight functions required under high temperature conditions also increase accordingly. Most of the thermal pads in the prior art contain silicon, and the silicon-containing pads Silicone oil seeps out under heat and stress between components, shortening the life of the thermal pad. [0003] However, the silicone-free thermal pads on the market are relatively expensive due to their imperfect preparation materials and processes. Therefore, a silicone-free thermal pad that completely inherits the advantages of silicone thermal pads does not leak oil, and its preparation cost is lower than that of the market. Silicone-free heat-conducting gaskets with low manufactu...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L33/00C08K13/02C08K3/22C08K5/18C08K5/57C08K3/04C09K5/14B29C35/02C08J3/24
CPCB29C35/02C08J3/247C08J2333/00C08K3/22C08K5/18C08K5/57C08K13/02C08K2003/2227C08K2003/2272C08L2312/00C09K5/14C08L33/00
Inventor 陈淑兰
Owner 杭州兆科电子材料有限公司