Packaging structure of radio frequency filtration module and packaging technology of packaging structure

Abstract

The invention provides a packaging structure of a radio frequency filtration module. The packaging structure is simple and excellent in packaging shielding effect and heat dissipating effect. The packaging structure comprises a substrate and chips arranged on the front face of the substrate, and further comprises a metal shielding cover. The four edges of the metal shielding cover vertically extend downwards respectively so that side walls and a packaging cavity can be formed. The substrate is covered with the metal shielding cover, the chips can be packaged in the packaging cavity, the chips are coated with heat-conducting glue, and the chips are connected with the metal shielding cover through the heat-conducting glue. The periphery of the substrate is provided with grounding through holes corresponding to the side walls of the metal shielding cover, the grounding through holes are filled with metal, the upper ends and the lower ends of the grounding through holes are printed with bonding pads respectively, the side walls of the metal shielding cover are welded to the bonding pads at the upper ends of the grounding through holes through tin cream, and the bonding pads at the lower ends of the grounding through holes are grounded. The invention further provides a packaging technology of the packaging structure.

Description

technical field [0001] The invention relates to the technical field of radio frequency filtering devices, in particular to a packaging structure of a radio frequency filtering module and a packaging process thereof. Background technique [0002] The surface acoustic wave filter is applied in the radio frequency filter module. For the surface acoustic wave filter, the shielding of the surface acoustic wave filter is particularly important for the filtering performance of the surface acoustic wave filter. When there is signal interference from the outside, the filter The effect will have a great impact; the RF filter module also includes high-power components, which have high output power, high power consumption, and high heat generation, so heat dissipation must be carried out. At present, the packaging of RF filter modules is mostly in the form of injection molding. In order to ensure the shielding effect of the surface acoustic wave filter, nickel plating is performed on th...

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Problems solved by technology

At present, the packaging of RF filter modules is mostly in the form of injection molding. In order to ensure the shielding effect of the surface acoustic wave filter, nickel plating is performed on the outer layer of injection molding to achieve shielding. The process is complicated; and the heat dissipation effect of injection molding materials is poor, which is not conducive to the RF filter module. Heat dissipation of high-power components

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