Two-dimensional ultrasonic vibration platform based on flexure hinge structure

Abstract

The invention discloses a two-dimensional ultrasonic vibration platform based on a flexure hinge structure. The two-dimensional ultrasonic vibration platform based on the flexure hinge structure comprises a two-freedom-degree movement decoupling flexible hinge platform body. The flexible hinge platform body comprises a square workbench arranged at the central position; four movement blocks are arranged around the square workbench and opposite to the four sides of the square workbench one by one; the inner side of each movement block is connected with one side of the square workbench opposite to the movement block through a rectangular flexible hinge of a parallel connection structure. The two ends of each movement block are connected with fixed blocks through rectangular flexible hinges of series connection structures. The fixed blocks are supported by supporting blocks which are fixed to a bearing plate. The supporting blocks are fixedly connected with the fixed blocks. Every two adjacent movement blocks in the four movement blocks are driven by two ultrasonic vibrators, and every two ultrasonic vibrators are perpendicularly arranged and supported by two supports; and the supports are fixed to the bearing plate. When micro milling is performed, and modification on a micro machine tool main shaft can be avoided by adopting the two-dimensional ultrasonic vibration platform based on the flexure hinge structure

Description

technical field [0001] The invention relates to the technical field of special processing, in particular to a two-dimensional ultrasonic vibration platform based on a flexible hinge structure. Background technique [0002] The demand for high-precision tiny parts in various fields of industry is increasing, especially in aerospace, biomedicine, electronic communication, environmental protection and other fields. Micro-cutting technology, especially micro-milling technology has its unique advantages in processing micro-components with three-dimensional complex structures, and has become an effective way to process small three-dimensional complex structural parts. However, micro-milling for hard and brittle materials such as ceramics, silicon, diamond, and optical glass still has problems such as severe tool wear, high heat generation, and poor surface quality. For the processing of hard and brittle materials, some scholars have proposed the method of combining ultrasonic vib...

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Problems solved by technology

[0003] Compared with traditional milling, micro-milling has higher requirements on the precision of the spindle, so it is not possible to add an ultrasonic vibration system to the spindle of the machine tool like a large machine tool.

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