3 results about "Flexure hinges" patented technology

The application discloses a three-freedom-degree large-stroke fast-tool-servo device, which comprises a workbench, a voice coil motor, a Z-direction displacement transmission mechanism, a three-axis connecting mechanism, an X-direction driving platform, a Y-direction driving platform, a tool holder and a tool. The three-axis connecting mechanism comprises a three-axis connecting plate and a three-axis connecting frame, and the three-axis connecting plate is connected with the three-axis connecting frame through X-axis and Y-axis flexible hinges around the three-axis connecting plate. The flexible hinges are provided with Z-axis flexible hinge points. The double-axis flexible hinges are provided with at least one X-axis flexible hinge point and one Y-axis flexible hinge point. The Z-direction displacement transmission mechanism, the three-axis connecting mechanism and the driver connecting rod are designed in an integrated mode. The piezoelectric ceramic driver is adopted. The three-freedom-degree active cutting of the tool can be realized, the large-stroke output capacity is achieved, the machining process of a complex optical surface can be efficiently completed, the displacement errors in multiple directions can be compensated, and the cutting force disturbance problem is solved.

The present invention relates to a multi-axis stage apparatus capable of significantly improving the precision of wafer bonding, a wafer bonding method using the apparatus, and a wafer bonding apparatus. The apparatus includes a base, an alignment stage configured to align a first wafer held by a first wafer chuck, a first driving device positioned between the base and the alignment stage and configured to vertically move the alignment stage with low precision, and a second driving device also positioned between the base and the alignment stage and configured to vertically move the alignment stage with high precision. The second driving device may include a flexure hinge, at least a portion of which is configured to distribute load. By combining coarse and fine vertical movement control and supporting structures based on flexure mechanics, the apparatus enables precise multi-axis alignment and bonding of wafers.

The present invention relates to a recoater system (11) for laying out a powder bed in a process chamber (1) of an additive manufacturing ap- paratus, wherein the recoater system (11) comprises: - a first track (13) and a second track (15) extending parallel to each other in a first direction (x), wherein the first track (13) and the sec- ond track (15) have a track distance (D) to each other in a second direction (y) that extends transverse to the first direction (x), and - a recoater unit (21) bridging the track distance (D), wherein the re- coater unit (21) comprises a first mounting element (23a) for mount- ing the recoater unit (21) to the first track (13) and a second mount- ing element (23b) for mounting the recoater unit (21) to the second track (15), so that the recoater unit (21) is guided by the first track (13) and the second track (15) to be movable in the first direction (x), wherein at least one of the first mounting element (23a) and the second mounting element (23b) comprises a first flexure hinge (35) defining a first flexure hinge axis (37) and a second flexure hinge (39) defining a second flexure hinge axis (41), wherein the first flexure hinge axis (37) and the second flexure hinge axis (41) extend transverse to the second direction (y) in parallel to each other, allowing a thermal expansion of the re- coater unit (21) in the second direction (y).