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Condenser microphone having flexure hinge diaphragm and method of manufacturing the same

a condenser microphone and hinge technology, applied in the field of condenser microphones, can solve the problems of poor performance of conventional condenser microphones having the conventional structure described above, insufficient sound pressure, etc., and achieve the effect of preventing diaphragm deformation

Inactive Publication Date: 2013-04-16
ELECTRONICS & TELECOMM RES INST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The patent text describes a method for etching multiple layers on a semiconductor device. The method involves using a combination of chemical and physical processes to remove the layers. By coating a protective layer on the device and removing it afterwards, the method prevents damage to the device during the etching process. The technical effect of the patent is to provide a reliable and effective way to remove multiple layers on a semiconductor device without causing damage.

Problems solved by technology

However, sufficient sound pressure has to be input to vibrate the diaphragms of these condenser microphones.
Moreover, the conventional condenser microphones having the conventional structure described above have poor performance in a low frequency range when scaled-down to 1 mm or less using a semiconductor MEMS process.

Method used

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  • Condenser microphone having flexure hinge diaphragm and method of manufacturing the same
  • Condenser microphone having flexure hinge diaphragm and method of manufacturing the same
  • Condenser microphone having flexure hinge diaphragm and method of manufacturing the same

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Embodiment Construction

[0025]Hereinafter, the present invention will be described in detail with reference to drawings illustrating exemplary embodiments of the present invention.

[0026]FIG. 2A is a partial perspective view of a structure of a condenser microphone having a flexure hinge diaphragm according to the present invention, and FIG. 2B is a cross-sectional view of the structure of the condenser microphone having the flexure hinge diaphragm according to the present invention. For convenience of description, sectional lines for some elements such as a sound hole and an air hole will be omitted.

[0027]Referring to FIGS. 2A and 2B, a condenser microphone 20 according to the present invention includes a silicon on insulator (SOI) wafer 21 including a lower silicon layer 21a, a first insulating layer 21b and an upper silicon layer 22 used as a back plate (hereinafter, referred to as “a back plate 22”), a second insulating layer 23 formed along an edge of the back plate 22, and a diaphragm 25 formed over t...

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Abstract

A micromini condenser microphone having a flexure hinge-shaped upper diaphragm and a back plate, and a method of manufacturing the same are provided.The method includes the steps of: forming a lower silicon layer and a first insulating layer; forming an upper silicon layer to be used as a back plate on the first insulating layer; forming a plurality of sound holes by patterning the upper silicon layer; forming a second insulating layer on the upper silicon layer; forming a conductive layer on the upper silicon layer having the sound holes, and forming a passivation layer on the conductive layer; forming a sacrificial layer on the passivation layer; depositing a diaphragm on the sacrificial layer, and forming a plurality of air holes passing through the diaphragm; forming electrode pads on the passivation layer and a region of the diaphragm; and etching the sacrificial layer, the passivation layer, the conductive layer, the upper silicon layer, the first insulating layer and the lower silicon layer to form an air gap between the diaphragm and the upper silicon layer.Consequently, due to the flexible diaphragm, a manufacturing process using semiconductor MEMS technology may improve the sensitivity of the condenser microphone and reduce the size of the condenser microphone, thereby enabling integration into a portable terminal.

Description

CROSS-REFERENCE TO RELATED APPLICATION[0001]This application claims priority to and the benefit of Korean Patent Application Nos. 2006-122736, filed Dec. 6, 2006, and 2007-54259, filed Jun. 4, 2007, the disclosures of which are incorporated herein by reference in their entirety.BACKGROUND[0002]1. Field of the Invention[0003]The present invention relates to a condenser microphone and a method of manufacturing the same, and more particularly, to a micromini condenser microphone having a flexure hinge diaphragm and a method of manufacturing the same.[0004]This work was supported by the IT R&D program of Ministry of Information and Communication / Institute for Information Technology Advancement [2006-S-006-01, Components / Module technology for Ubiquitous Terminals.][0005]2. Discussion of Related Art[0006]Generally, a condenser microphone uses a principle in which a change in capacitance caused by vibration of a diaphragm due to external vibration sound pressure is output into an electrica...

Claims

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Application Information

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Patent Type & Authority Patents(United States)
IPC IPC(8): H04R25/00
CPCH04R31/00H04R31/003H04R19/005Y10T29/41H04R2499/11
Inventor KIM, HYE JINLEE, SUNG QPARK, KANG HOKIM, JONG DAE
Owner ELECTRONICS & TELECOMM RES INST
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