Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Manufacturing method of electronic components

A manufacturing method and technology of electronic components, applied in transformer/inductor parts, electrical components, inductance/transformer/magnet manufacturing, etc., can solve the problems of forming external electrodes and inability to plate, and achieve the effect of inhibiting liquid wetting and expansion

Active Publication Date: 2018-06-19
MURATA MFG CO LTD
View PDF7 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As a result, there is a concern that plating cannot be performed at desired positions, that is, external electrodes cannot be formed at desired positions.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Manufacturing method of electronic components
  • Manufacturing method of electronic components
  • Manufacturing method of electronic components

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0092]

[0093] First, 100 objects including a main body formed of a composite material of metal magnetic powder and resin, and a coil arranged inside the main body with its end exposed from the main body were prepared. Then, the object is inserted into the hole H3 of the mask 200 using a fluororesin for the rubber N so that both ends of the object are exposed from the mask 200 . The mask 200 with the object inserted into the hole H3 is dipped in the conductive solution, and the conductive solution is attached to both ends of the object (in other words, the portion exposed from the mask 200 ). Thereafter, the object is dried, taken out from the mask 200, and subjected to plating treatment to form a plated film on both ends of the object. When 100 objects were observed with a stereo microscope, the coating was peeled off from 12 objects.

[0094]

[0095] A plating film was formed on the object in the same manner as in Example 1, except that rubber N was used and a silicon...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
particle sizeaaaaaaaaaa
particle sizeaaaaaaaaaa
particle sizeaaaaaaaaaa
Login to View More

Abstract

The invention provides a method for manufacturing an electronic component, and the method comprises a step for attaching conductive liquid to the electronic component, in order to suppress wetting of the conductive liquid. The method comprises a step for attaching a conductive solution to a body (10). In addition, the method for manufacturing the electronic component (1) comprises the following steps: (1) an insertion process, that is the body (10) is inserted into a mask (200) which is provided with holes (H3) for inserting the body (10), in order to expose an end (E1) of the body (10); a conductivity inparting step, that is the mask (200) with inserted body (10) is dippped into the conductive solution. A tightening margin (T) exists between the holes (H3) of the mask (200) and the body (10) as well as at a direction perpendicular to the vertical direction.

Description

technical field [0001] The present invention relates to a method of manufacturing electronic components, and more particularly to a method of manufacturing electronic components in which external electrodes are formed by plating. Background technique [0002] As a method of forming an external electrode on an electronic component, for example, a method for forming an external electrode described in Patent Document 1 (hereinafter referred to as a conventional electrode forming method) is known. The conventional electrode forming method is not a method of forming external electrodes by plating, but is performed by applying a conductive paste to an electronic component. Specifically, a target electronic component is inserted into and held in each holding hole of the holding jig so that a part of the electronic component is exposed. Also, apply conductive paste to the paste filling hole of the paste pouring table. Then, by moving the holding jig toward the paste pouring table,...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H01F41/00H01F27/29C25D5/02
CPCC25D5/022H01F27/292H01F41/00
Inventor 荒川裕介上田佳功菅野行信服部晃典
Owner MURATA MFG CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com