Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Mounting structure and module

A technology for mounting structures and bumps, which is applied in the direction of assembling printed circuits with electrical components, semiconductor/solid-state device components, sustainable manufacturing/processing, etc.

Active Publication Date: 2018-04-17
THE FUJIKURA CABLE WORKS LTD
View PDF5 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in order to multilayer the wiring board, the number of steps increases and the manufacturing cost increases.
In addition, in the structure in which the wiring is drawn downward from the terminals by multilayering, when the terminals of the semiconductor device and the terminals of the wiring board are connected by bumps, shrinkage occurs directly under the bumps due to the solidification of the solder. of stress, and thus there is a concern that the reliability of the connection deteriorates
In addition, the multilayer structure has a structure in which an interlayer insulating film is sandwiched between conductors, so there is a possibility that the transmission loss may deteriorate due to an increase in the capacitance component.
In addition, if an insulating film is placed between conductors, the wavelength of the signal transmitted to the conductors will be shortened, and the frequency characteristics will change compared to the case where the multilayer structure is not formed, so there is a problem that the design is complicated.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Mounting structure and module
  • Mounting structure and module
  • Mounting structure and module

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0059] Figure 3A as well as Figure 3B The mounting structure of Example 1 is shown in . The mounting structure according to the first embodiment constitutes a module structure of an interposer substrate on which ICs are mounted as the semiconductor device 20 . The wiring board 10A of the first embodiment is an interposer substrate, and connects IC terminals (first terminals 21 ) with a narrow pitch of about 100 μm and FPC terminals (third terminals 14 ) with a wide pitch of about 500 μm.

[0060] The photosensitive insulating film 15 completely covers the wiring 12 , but an opening is formed in the photosensitive insulating film 15 inside the end portion 15 a in a region surrounded by the IC I / O terminal (second terminal 13 ). The width of the second terminal 13 (the dimension in the pitch direction, the width of the second terminal 13 in the direction in which the plurality of second terminals are arranged) is, for example, 70 μm. The width of the wiring 12 is, for examp...

Embodiment 2

[0064] Figure 4A as well as Figure 4B The mounting structure of Example 2 is shown in . In the second embodiment, the structure of the wiring board 10B is the same as that of the first embodiment, but the insulating material disposed around the bump 16 is the side filler 18 . The side filler 18 (for example, epoxy-based or the like) is disposed only on the peripheral portion of the lower surface of the semiconductor device 20 where the first terminal 21 and the bump 16 are provided by adjusting the viscosity. A cavity 19 is formed between the semiconductor device 20 and the wiring board 10B (specifically, between the insulating substrate 11 ). In the case of high-frequency transmission applications, there are cases where the transmission loss deteriorates due to the dielectric between the IC and the interposer. By using the side filler 18, a gas (air, etc.) with a low dielectric constant is arranged in the cavity 19, so that the stress relaxation function can be obtained ...

Embodiment 3

[0066] Figure 5A as well as Figure 5B The mounting structure of Example 3 is shown in . The third terminal 14 of the wiring board 10C of the third embodiment constitutes a card edge connector. For the structure directly below the semiconductor device 20, in Figure 5A as well as Figure 5B Although the case of using the same underfill 17 as in Example 1 is exemplified in FIG. 1 , it is also possible to use the side filler 18 like in Example 2. The end portion 15c of the photosensitive insulating film 15 that is in contact with the card edge connector is, for example, linear.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a mounting structure provided with: a semiconductor device having a first terminal; a second terminal arranged facing the first terminal, the second terminal having a first endpart; a wire drawn from the end surface of the first end part; a wiring substrate having a photosensitive insulation film for covering the wire and the first end part; and a bump for electrically connecting between the first terminal and the second terminal.

Description

technical field [0001] The present invention relates to a mounting structure in which a semiconductor device is mounted on a wiring board, and a module including the mounting structure. [0002] This application claims priority based on Japanese Patent Application No. 2016-038207 for which it applied to Japan on February 29, 2016, and uses the content here. Background technique [0003] In order to respond to demands for miniaturization and speedup of electronic equipment, miniaturization and speedup are also being pursued in semiconductor device mounting technologies. Flip chip bonding is adopted as a method of mounting semiconductor devices in various electronic devices due to the advantages of reducing the mounting area of ​​semiconductor devices and shortening the length of wiring compared with wire bonding. [0004] Flip-chip bonding refers to a mounting method in which a plurality of terminals of a semiconductor device such as an IC are opposed to a plurality of termi...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H01L21/60H05K3/34
CPCH05K3/34H01L2224/73204H01L23/49838H01L2224/0401H01L2224/16227H01L2224/32225H01L2924/15192H01L2924/351H01L2224/81447H01L2224/81439H01L2224/81424H01L2224/81455H01L2224/81444H01L2224/81471H01L2224/81466H01L2924/15323H01L2224/131H01L2224/10175H01L24/16H01L24/81H01L24/73H01L24/32H01L2924/014H01L2924/00014H01L2224/16225H01L2924/00
Inventor 松丸幸平
Owner THE FUJIKURA CABLE WORKS LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com