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Bismuth telluride nanoparticle strengthened tin, silver and copper solder and using method thereof

A technology of nano-particles and bismuth telluride, applied in welding/cutting media/materials, welding media, welding equipment, etc., can solve the problems of nano-particle coarsening, nano-particle loss, nano-particle and tin-silver-copper solder interface, etc. Achieve the effect of slow coarsening process, low loss rate and slow down coarsening

Active Publication Date: 2016-09-14
SHANGHAI RADIO EQUIP RES INST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide a solder for packaging and interconnection of electronic products and its use method, select suitable nanoparticle materials to solve the problems of nanoparticle loss, nanoparticle coarsening and nanoparticle enhancement faced by nanoparticle reinforced tin-silver copper solder. Particle to SnAgCu Solder Interface Issues

Method used

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  • Bismuth telluride nanoparticle strengthened tin, silver and copper solder and using method thereof
  • Bismuth telluride nanoparticle strengthened tin, silver and copper solder and using method thereof
  • Bismuth telluride nanoparticle strengthened tin, silver and copper solder and using method thereof

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Embodiment 1

[0033] The solder of this embodiment consists of Bi in weight percent 2 Te 3 Nanoparticles 0.5%, Sn-3.0Ag-0.5Cu micron powder 87.5% and rosin flux 12%, with a total weight of 10 g.

[0034] Methods of using solder include:

[0035] Step 1, using a planetary mixer to mix Bi 2 Te 3 The nanoparticles are evenly stirred with the rosin flux. The stirring revolution speed is 1000 revolutions per minute, the autopropagation speed is 800 revolutions per minute, and the stirring time is 150 s.

[0036] Step 2, adding Sn-3.0Ag-0.5Cu micron powder into Bi 2 Te 3 The mixture of nanoparticles and flux is stirred using a planetary mixer to prepare Bi 2 Te 3 Nanoparticle Reinforced Sn-3.0Ag-0.5Cu Solder Paste. The stirring revolution speed is 800 rpm, the autorotation speed is 800 rpm, and the stirring time is 120 s.

[0037]Step 3, using Sn-3.0Ag-0.5Cu solder paste to form solder joints through a reflow soldering process. The welding peak temperature is 240 ℃, and the time above ...

Embodiment 2

[0042] The solder of this embodiment consists of Bi in weight percent 2 Te 3 Nanoparticles 1%, Sn-3.0Ag-0.5Cu micron powder 87% and rosin flux 12%, with a total weight of 10 g.

[0043] Methods of using solder include:

[0044] Step 1, using a planetary mixer to mix Bi 2 Te 3 The nanoparticles are evenly stirred with the rosin flux. The stirring revolution speed is 1100 revolutions per minute, the autopropagation speed is 850 revolutions per minute, and the stirring time is 180 s.

[0045] Step 2, adding Sn-3.0Ag-0.5Cu micron powder into Bi 2 Te 3 The mixture of nanoparticles and flux is stirred using a planetary mixer to prepare Bi 2 Te 3 Nanoparticle Reinforced Sn-3.0Ag-0.5Cu Solder Paste. The stirring revolution speed is 850 rpm, the autorotation speed is 850 rpm, and the stirring time is 150 s.

[0046] Step 3, using Sn-3.0Ag-0.5Cu solder paste to form solder joints through a reflow soldering process. The welding peak temperature is 240 ℃, and the time above the...

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Abstract

The invention discloses a bismuth telluride nanoparticle strengthened tin, silver and copper solder and a using method thereof. The solder is prepared from, by weight percent, 0.5%-1% of bismuth telluride nanoparticles, 80%-90% of tin, silver and copper micrometer powder and 10%-20% of soldering flux. The average particle size of the bismuth telluride nanoparticles is 20 nm, and the atom ratio of the tellurium element to the bismuth element is 3:2. The average particle size of the tin, silver and copper micrometer powder is 30 microns, and the weight percentage of the tin element to the silver element to the copper element is 96.50%:3.0%:0.5%. The soldering flux is a rosin soldering flux. The invention further provides the using method of the bismuth telluride nanoparticle strengthened tin, silver and copper solder. According to the bismuth telluride nanoparticle strengthened tin, silver and copper solder and the using method of the bismuth telluride nanoparticle strengthened tin, silver and copper solder, by selecting the proper nanoparticles, the problems, such as nanoparticle losses, nanoparticle coarsening and interfaces of the nanoparticles and the tin, silver and copper solder, of the nanoparticle strengthened tin, silver and copper solder are solved.

Description

technical field [0001] The invention relates to a solder and its use method, in particular to a bismuth telluride nanoparticle reinforced tin-silver-copper solder and its use method. Background technique [0002] Tin-silver-copper solder has been widely used as an electronic packaging and interconnection material in electronic products to replace lead-containing solder that is harmful to the environment. However, the increase in the packaging density of electronic products and the reduction in the size of solder joints have put forward higher requirements on the strength of solder products. At present, a common method of improving tin-silver-copper solder is to add tiny particles to the tin-silver-copper solder, and achieve strengthening by virtue of the dispersion strengthening effect of the tiny particles. Studies have shown that nanoparticles have a more obvious strengthening effect than microparticles, so they have received extensive attention. At present, the nanopart...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/26B23K35/36
CPCB23K35/262B23K35/3601
Inventor 陈思沈艳王帅
Owner SHANGHAI RADIO EQUIP RES INST
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