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Etching resist composition and dry film

A technology of composition and resist, which is applied in the direction of optics, optomechanical equipment, instruments, etc., and can solve problems such as inability to obtain patterns and penetration of etching solution

Active Publication Date: 2016-09-14
TAIYO INK MFG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0008] Hydrofluoric acid-based etchant has a strong permeability, so unless a process such as forming a thick resist film is performed, there is a problem that the etchant penetrates between the glass substrate and the resist, and a desired pattern cannot be obtained.

Method used

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  • Etching resist composition and dry film
  • Etching resist composition and dry film
  • Etching resist composition and dry film

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Embodiment

[0086] Hereinafter, although an Example and a comparative example are shown and this invention is concretely demonstrated, this invention is not limited to a following example. In addition, below, "part" and "%" are mass standards unless otherwise specified.

[0087] (Alkali-soluble resin having a biphenyl structure: Resin A-1)

[0088] Drop into the epoxy resin (NC-3000P that Nippon Kayaku Co., Ltd. manufactures, epoxy equivalent 286, softening point 67 ℃, n is 2.24.) represented by above-mentioned general formula (1). 2860g (10 equivalents), acrylic acid 720.6g ( 10 equivalents), methyl hydroquinone 5.5g, carbitol acetate 1349.6g and solvent naphtha 578.4g, heated and stirred at 90°C to dissolve the reaction mixture. Next, the reaction solution was cooled to 60°C, 16.5 g of triphenylphosphine was added, heated to 98°C, and the reaction was carried out for about 32 hours. After the acid value (mgKOH / g) became 3.0 or less, it was cooled to obtain an epoxy acrylate resin (a-1...

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Abstract

The invention provides an etching resist composition which can form an etching resist film with excellent hydrofluoric acid resistance and a dry film. The etching resist composition is characterized by including alkali-soluble resin of a biphenyl structure. The invention also provides the dry film with the etching resist composition.

Description

technical field [0001] The present invention relates to a resist composition and a dry film. Specifically, it relates to a resist composition capable of forming a resist film excellent in hydrofluoric acid resistance, and a dry film having a resin layer obtained from the composition. Background technique [0002] In the processing of glass products, in recent years, due to the further demand for fine processing and smoothing. In addition, glass tends to be cracked during mechanical processing using a drill, so processing by glass etching has become the mainstream. [0003] Glass etching is a method that has been conventionally applied to glass bodies such as electronic materials, optical materials, and measuring instruments. As a method of glass etching, for example, a method of coating a resin composition on the surface of a glass substrate to be etched, drying or curing it by heat to form a resist film, and then immersing the glass substrate in a hydrofluoric acid-based ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/027G03F7/004
CPCG03F7/004G03F7/027
Inventor 西尾一则宫泽俊春
Owner TAIYO INK MFG
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