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Buffer sandwich plate

A sandwich panel and buffer layer technology, applied in the field of sandwich panels, can solve the problems of no essential improvement in mechanical properties, failure to meet requirements, and no application potential of buffer sandwich panels, so as to improve strength and elastic-plastic deformation capacity, light weight, and easy fill effect

Inactive Publication Date: 2016-09-21
SOUTHEAST UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, for decades, for sandwich panels with a thin-walled core layer, the core layer has either changed in shape such as hexagons or squares, or changed in size, and has hardly improved the structure of the sandwich core. As a result, its various mechanical properties have not been substantially improved, and it has not kept up with the development of modern technology and developed greater application potential for buffer sandwich panels.
Previously, Chen Jinxiang and others proposed sandwich panels with reinforced columns in the core layer, but after theoretical analysis and experimental proof, they came to the following conclusions: Although honeycomb sandwich panels can effectively improve the compressive performance, flexural performance and elastic deformation properties of honeycomb panels. Various mechanical performance indicators in terms of deformation, but for applications such as cushioning and energy absorption that require plastic deformation, it cannot meet the requirements

Method used

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Examples

Experimental program
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Effect test

Embodiment 1

[0049] Embodiment 1 A light-weight high-strength edge-banding buffer sandwich panel

[0050] The structure consists of upper and lower plywood, and a grid layer with thin-walled columns. The edge banding structure integrated with the plate is made around the plate according to the needs, which is convenient for standardized use;

Embodiment 2

[0051] Example 2 A light-weight, high-strength heat-insulating and heat-insulating buffer interlayer board

[0052] Except for the upper and lower splints and the grid layer with thin-walled columns, the selected materials are all materials with good thermal insulation performance, and the cavity of the middle layer is filled with thermal insulation materials to realize the light weight and high strength of the board. On the basis of it, it also has corresponding excellent thermal insulation performance;

Embodiment 3

[0053] Embodiment 3 A light-weight high-strength sound-insulating buffer sandwich panel

[0054] In addition to the upper and lower splints and the grid layer containing thin-walled columns, the structure is filled with materials with better sound insulation performance in the cavity, so that the board can achieve the purpose of light weight and high strength sound insulation;

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PUM

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Abstract

The invention discloses a buffer sandwich plate which comprises an upper clamping plate, a lower clamping plate and a middle buffer layer. The middle buffer layer is of a thin-wall polygonal grid-column structure which is composed of polygonal grid units and hollow thin-wall columns interesting between the adjacent polygonal grid units. The ends of the grid walls of the polygonal grid units are connected to the wall faces of the thin-wall columns. The circle centers of the thin-wall columns are located in the center of the grid column intersecting position. The thin-wall column structure can effectively restrain the plane external deformation of the grid walls, the bent grid wall strength and elasticoplastic deformation capacity are improved, it is ensured that the grid units and the thin-wall columns work together all the time, the compressive strength and buffer performance of the sandwich plate are effectively improved, the sandwich plate with lower weight, higher strength and better buffer performance is obtained, the buffer sandwich plate is particularly applicable to the fields of aerospace, ship traffic and the like, and life and property security of people and the main body structure can be effectively ensured.

Description

technical field [0001] The invention relates to a sandwich panel, in particular to a buffer sandwich panel with a thin-walled polygonal grid-column structure in the core layer, and the grid wall and the column both have thin-wall characteristics. Background technique [0002] Today, when energy saving and environmental protection have become the main evaluation index of products, the research of new lightweight and high-strength structures has attracted people's attention. Sandwich panels have become one of the indispensable structures in the fields of aviation, aerospace, railways, automobiles, and construction due to their light weight, high rigidity, and good cushioning performance. Due to the high production cost at the beginning, it has been mainly used in the aerospace field since the 1950s. Later, with the advancement of science and technology, the improvement of process methods was gradually applied to other industrial fields. Materials for making sandwich panels i...

Claims

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Application Information

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IPC IPC(8): B32B3/12B32B3/08B32B33/00
CPCB32B3/12B32B3/08B32B33/00B32B2307/56
Inventor 陈锦祥张晓明谢娟徐梦烨
Owner SOUTHEAST UNIV