Temperature measuring device and measuring method for measuring temperature of assembly line products

Abstract

The invention is applicable to the technical field of temperature measurement of assembly line products, and discloses a temperature measurement device and a measurement method for measuring the temperature of assembly line products. The temperature measuring device includes a temperature sensor, a base and a swing arm. The swing arm is rotatably connected to the base. The base is connected with a positioning block. An elastic piece is connected between the positioning block and the swing arm. The temperature sensor is connected to the swing arm. The temperature measurement method adopts the above-mentioned temperature measuring device for measuring the temperature of the assembly line products, including the following steps: each assembly line product is sequentially pressed against the temperature sensor of the temperature measurement device and the swing arm is rotated forward against the elastic force of the elastic member, and the temperature sensor The temperature of the assembly line product is measured, and after the assembly line product is separated from the temperature measuring device, the arm rotates reversely to the initial position under the restoring force of the elastic member. The temperature measuring device and method for measuring the temperature of products in a pipeline provided by the invention have high temperature measurement efficiency and small measurement error.

Description

technical field [0001] The invention belongs to the technical field of temperature measurement of assembly line products, in particular to a temperature measuring device and method for measuring the temperature of assembly line products. Background technique [0002] For engineering temperature measurement, infrared imaging temperature measurement and thermocouple temperature measurement are commonly used. Infrared imaging temperature measurement is non-contact temperature measurement, and thermocouple is contact temperature measurement. The results of infrared imaging temperature measurement are greatly affected by the measurement distance, and the measurement error is much larger than that of thermocouple temperature measurement. Thermocouple temperature measurement uses two different metal conductors in contact as probes. The probe converts the temperature signal into an electrical signal for detection. Therefore, in the process of thermocouple temperature measurement, th...

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Problems solved by technology

[0003] The schematic diagram of the thermocouple probe is connected with the tip probe by two parallel wires. The whole wire is very soft. This characteristic makes it inconvenient to fix the contact between the tip probe and the measured object when the thermocouple measures temperature. It is necessary to replace the measured object frequently. especially in the case of objects

The current fixing methods for thermocouples are mainly fixed by mechanical components or adhesives / adhesive tapes, but this fixing method is only suitable for situations where the measured object does not move, and cannot measure the temperature of samples on the assembly line with thermocouples. In addition, the glue method will inevitably increase the heat capacity of the thermocouple probe and expand the measurement error

[0004] The thermocouple probe clamping device in the prior art can only measure the temperature of fixed and non-moving items, but can’t do anything for products moving on the assembly line; in addition, the prior art uses adhesives / adhesive tapes for fixing, Inevitably increases the heat capacity of the probe, resulting in increased measurement errors

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