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Packaging structure used for three-dimensional system level packaging and packaging method

A system-level packaging and packaging structure technology, which is applied in the direction of microstructure devices, processing microstructure devices, microstructure technology, etc., can solve the problems of high cost of metal packaging and ceramic packaging, and cannot meet the needs of consumers for low cost.

Active Publication Date: 2016-09-21
TSINGHUA UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the cost of both metal packaging and ceramic packaging is high, which cannot meet consumers' demand for low cost

Method used

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  • Packaging structure used for three-dimensional system level packaging and packaging method
  • Packaging structure used for three-dimensional system level packaging and packaging method
  • Packaging structure used for three-dimensional system level packaging and packaging method

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Embodiment Construction

[0026] Specific embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings. It should be understood that the specific embodiments described here are only used to illustrate and explain the present invention, and are not intended to limit the present invention.

[0027] In the present invention, unless otherwise stated, the used orientation words such as "upper, lower, bottom, top" are usually defined in the normal use of the package structure provided by the present invention, specifically refer to Figure 1 to Figure 8b Orientation shown on the drawing. It should be noted that these orientation words are only used to illustrate the present invention, and are not used to limit the present invention.

[0028] figure 1 is a schematic diagram of a package structure provided according to an embodiment of the present invention. Such as figure 1 As shown, the packaging structure 100 may include: a first carrier 101 , wher...

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Abstract

The invention discloses a packaging structure used for three-dimensional system level packaging and a packaging method. The packaging structure comprises a first support plate; a first component set wherein the first component set is arranged on the upper surface of the first support plate, is electrically connected with a wiring structure on the first support plate and comprises a cavity packaging type component and / or a non-cavity packaging type component; an annular moulding body arranged on the upper surface of the first support plate and forming a cavity with the first support plate; a second support plate arranged on the annular moulding body and sealing the cavity; a second component set, wherein the second component set is arranged on the lower surface of the second support plate, is electrically connected with a wiring structure on the second support plate and comprises a cavity packaging type component, and the cavity packaging type component is accommodated in the cavity; and a first conductive connection member connected with the wiring structure of the second support plate and the wiring structure of the first support plate so as to enable electric connection between the first component set and the second component set. In this way, the three-dimensional system level packaging with the cavity is realized with relatively low cost.

Description

technical field [0001] The present invention relates to the field of three-dimensional system-level packaging, in particular to a packaging structure and a packaging method for three-dimensional system-level packaging. Background technique [0002] System-in-Package (SiP) is a general term for a packaging method. The International Semiconductor Roadmap (ITRS) defined SiP in 2011 as: System-in-Package is a combination of multiple active devices with different functions. Integrated in one package, a single package can provide multiple functions of a system or subsystem. SiP can optionally contain various components. Among these components, some components need to be packaged in a cavity, such as micro-electromechanical systems (MEMS) devices. At present, cavity packaging mostly relies on metal packaging technology or ceramic packaging technology. With the development of the electronics industry, while consumers require electronic products to be short, small, light, and thin...

Claims

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Application Information

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IPC IPC(8): H01L23/08H01L23/13H01L23/14H01L23/538H01L21/48H01L21/768B81B7/00B81C3/00
CPCH01L23/5386H01L23/5389H01L24/82H01L21/4803H01L23/08H01L23/13H01L23/145B81B7/0006B81B7/0074B81C3/001H01L2224/82986H01L2924/15311H01L2224/16145H01L2224/16225H01L2224/48091H01L2224/48227H01L2924/00014
Inventor 李诚蔡坚王谦陈瑜
Owner TSINGHUA UNIV