Compositions for high speed printing of conductive materials for electronic circuitry type applications, and methods relating

Abstract

The present invention is directed to compositions for high speed printing of conductive materials for electronic circuitry type applications. These compositions are dispersions having a continuous (e.g., solvent) phase and a discontinuous phase. The discontinuous phase includes a plurality of nanoparticles stabilized with a thermally decomposable stabilizer. The thermally decomposable stabilizer is an Phi-b-theta-Y block co-polymer or oligomer where: i. Phi is a polymeric block or series of polymeric blocks that swell and suspend in the continuous phase; ii. b indicates a covalent bond between Phi and theta; iii. theta comprises at least one moiety from the group consisting of tertiary amines, electron rich aromatics, acrylates, methacrylates and combinations thereof; and iv. Y is a dithioester, a xanthate, a dithiocarbamate, a trithiocarbonate or a combination thereof.

Description

technical field

[0001] The technical field generally relates to dispersions of conductive nanoparticles that can be destabilized by applying relatively low levels of thermal energy or by using relatively low levels of electromagnetic (e.g., ultraviolet light or microwave) radiation to intentionally cause the nanoparticles to fall out of suspension. exfoliate and form the desired characteristic structure of conductive nanoparticle agglomerates. More specifically, the composition of the present invention is useful for high-speed printing of conductive materials for electronic circuit type applications and the like. Background technique

[0002] There is a need to inexpensively fabricate conductive circuit features on circuit boards and other substrates. Typically high vacuum techniques such as sputtering, chemical vapor deposition (CVD) and atomic layer deposition (ALD) are used. Such techniques are generally capable of high quality conductor deposition, but tend to suffer f...

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