Hot treatment device and method

A technology of heat treatment device and heat treatment method, which is applied in the direction of electrical components, semiconductor/solid-state device manufacturing, circuits, etc., and can solve problems such as excessive heat treatment

Active Publication Date: 2016-10-12
DAINIPPON SCREEN MTG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in this case, the outer peripheral portion or central portion of the substrate may be subjected to excessive heat treatment
That is, in the conventional heat treatment apparatus, it is difficult to heat treat the substrate in a short time and uniformly heat treat the entire surface of the substrate.

Method used

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  • Hot treatment device and method

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Experimental program
Comparison scheme
Effect test

no. 1 approach ＞

[0069]

[0070] figure 1 It is a schematic diagram showing the structure of the substrate processing apparatus 100 provided with the heat processing apparatus of the first embodiment. The substrate processing apparatus 100 of this embodiment is an apparatus for applying a resist solution, exposing, and developing after exposure to a rectangular glass substrate 9 (hereinafter, simply referred to as “substrate 9 ”) used in a liquid crystal display device.

[0071] Such as figure 1 As shown, the substrate processing apparatus 100 has an indexer 10, a cleaning unit 11, a dehydration drying unit 12, a coating unit 13, a decompression drying unit 14, a pre-drying unit 15, a transfer unit 16, an exposure unit 17, a developing unit 18, Rinsing section 19 and post-drying section 20. The processing units 10 to 20 of the substrate processing apparatus 100 are arranged adjacent to each other in the order described above. Such as figure 1 As indicated by the dotted line arrows in , t...

no. 2 approach ＞

[0107]

[0108] Next, a second embodiment of the present invention will be described. In addition, the heat processing apparatus 1 of this embodiment is the same as the heat processing apparatus 1 of the first embodiment, and can also be applied to the cooling section in the dehydration drying section 12 of the substrate processing apparatus 100, the cooling section in the pre-drying section 15, and the post-drying section. The cooling part in the drying part 20.

[0109] Image 6 It is a schematic sectional view of the heat processing apparatus 1 of 2nd Embodiment. Figure 7 It is a schematic plan view of the heat treatment apparatus 1 . Such as Image 6 as well as Figure 7 As shown, the heat treatment apparatus 1 of this embodiment has a heat treatment plate 30 , a temperature adjustment mechanism 40 , a plurality of lift pins 50 , a lift mechanism 60 , a temperature measurement unit 70 and a control unit 80 . In the following description, differences from the first ...

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Abstract

The invention provides a hot treatment device and method, which can uniformly carry out a hot treatment on the whole surface of a substrate in a short time. The hot treatment device (1) has a plurality of elevating pins (51) for supporting the periphery (91) of a substrate (9); and a plurality of second evaluating pins (52) for supporting the center (92) of the substrate (9). A temperature mechanism (40) raises the temperature of a hot treatment plate (30) until the central area of the hot treatment plate (30) is higher than the target temperature. After the hot treatment is started and the center (92) of the substrate (9) reaches the target temperature, the control part (80) drives the elevating mechanism (60) to elevate the second elevating pins (52) so as to separate the center (92) of the substrate (9) from the hot treatment plate (30). Thus, the center (92) of the substrate (9) is taken as the baseline, and the whole surface of the substrate (9) can be uniformly and thermally processed in a short time.

Description

technical field [0001] The present invention relates to a heat treatment device and a heat treatment method for cooling or heating a substrate to a target temperature. Background technique [0002] In the past, precision electronic devices such as semiconductor wafers, glass substrates for liquid crystal display devices, glass substrates for PDPs, glass substrates for photomasks, substrates for color filters, substrates for recording disks, substrates for solar cells, and substrates for e-books In the manufacturing process of the substrate, a heat treatment apparatus for cooling or heating the substrate is used. The heat treatment apparatus is used, for example, in a step of curing a processing liquid such as a photoresist applied on a substrate, and a step of drying a cleaned substrate. [0003] For example, Patent Documents 1 and 2 describe conventional heat treatment apparatuses. Patent Document 1 describes a substrate temperature adjustment unit that adjusts the temper...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67H01L21/66
CPCH01L21/67103H01L21/67248H01L22/20
Inventor 山冈英人芳谷光明
Owner DAINIPPON SCREEN MTG CO LTD
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