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Methods used to process chips

A technology of chip and fixing method, which is applied in the direction of circuits, electric solid-state devices, semiconductor devices, etc., and can solve problems such as chip damage

Active Publication Date: 2019-06-28
INFINEON TECH AG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As a consequence, the chip may be damaged during operation
These issues may be more pronounced for power devices and power components operating at high current

Method used

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  • Methods used to process chips
  • Methods used to process chips
  • Methods used to process chips

Examples

Experimental program
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Embodiment approach

[0083] According to one embodiment, the chip may comprise: a chip body; a front side metallization on the front side of the chip body and / or a backside metallization on the back side of the chip body, so that the chip can The temperature range is flat or has a positive radius of curvature.

[0084] In one example of the embodiment, the chip body may include a semiconductor substrate.

[0085] In another example of the embodiment, the temperature range of the chip attachment method may be from about 150°C to about 400°C.

[0086] In another example of this embodiment, the coefficient of thermal expansion of the front side metallization structure may be smaller than the coefficient of thermal expansion of the backside metallization structure.

[0087] In another example of this embodiment, the front metallization structure and the backside metallization structure may comprise the same material, and the thickness of the front metallization structure may be smaller than the thick...

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Abstract

In various embodiments a chip is provided. The chip may comprise a chip body and a front metallization structure on the front side of the chip body and / or a backside metallization structure on the back side of the chip body, so that the chip is The temperature range is flat or has a positive radius of curvature.

Description

technical field [0001] Various embodiments generally relate to methods for processing chips. Furthermore, various embodiments relate to methods for processing chips that enable improved chip fixation quality. Background technique [0002] There are four main methods for die attach, namely, metal-filled polymer die attach, metal / sinter die attach, eutectic die attach, and solder-based die attach. Among these methods, soldering-based chip attachment is popular because it is largely reliable while being easy to handle. Furthermore, the solder used in the soldering-based chip attachment method not only has excellent thermal and electrical conductivity, but also has low mismatch due to the coefficient of thermal expansion (CTE=coefficient of thermal expansion). [0003] However, cavity and bubble formation in the solder is a problem encountered in solder-based die attach methods. Cavity and bubble formation are the result of different parameters of the solder-based die attach ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/485H01L23/14H01L21/56
CPCH01L21/56H01L23/14H01L23/485H01L23/562C22C19/03H01L2924/3511H01L24/83H01L2224/05647H01L2224/05611H01L2224/05624H01L2224/05644H01L2224/05639H01L2224/05655H01L2224/05669H01L2224/32145H01L2224/32225H01L2224/83192H01L2224/04026H01L2224/0603H01L2924/1203H01L2924/10272H01L2924/13091H01L2924/10253H01L2924/13055H01L2924/1301H01L24/29H01L24/05H01L2924/14H01L24/06H01L2224/83948H01L2224/83801H01L24/32H01L2224/29147H01L2224/29124H01L2224/29139H01L2224/29111H01L2224/29169H01L2224/29144H01L2224/29155H01L2924/00014H01L2924/00012H01L2924/013H01L2924/01023H01L2924/20105H01L2924/20106H01L2924/20107H01L2924/20108H01L2924/20109H01L2924/2011H01L2924/01029H01L2924/0105H01L2924/01013H01L2924/01079H01L2924/01047H01L2924/01028H01L2924/01078H01L2924/01007H01L2924/0132
Inventor M·施内甘斯M·聪德尔
Owner INFINEON TECH AG