Metal lead frame structure with low test cost and manufacturing method thereof

Abstract

The invention relates to a metal lead frame structure with a low test cost and a manufacturing method thereof, which belong to the technical field of semiconductor packaging. The metal lead frame structure comprises multiple units; each unit comprises a pin; the pin comprises a first metal layer (1) and a second metal layer (2); the second metal layer (2) is arranged on the front face of the first metal layer (1); gaps between the pins are filled with molding compounds (4); third metal layers (3) are arranged on the back face of the first metal layer (1) and the front face of the second metal layer (2); a groove (5) is arranged between pins of adjacent two units; and the groove (5) separates the pins of the adjacent two units. According to the metal lead frame structure with a low test cost and the manufacturing method thereof provided by the invention, a whole-process testable ability can be brought, the test cost can be greatly reduced, and the quality and the efficiency are improved.

Description

technical field [0001] The invention relates to a metal lead frame structure with low test cost and a manufacturing method thereof, belonging to the technical field of semiconductor packaging. Background technique [0002] The current packaging and testing are integrated, the substrate material needs to be tested, and various tests are required after packaging. The test is based on a piece, which is inefficient and time-consuming. [0003] The usual metal lead frame and MIS metal plated plastic packaging substrate, the pins of a single chip are connected, and the connection relationship of each individual chip cannot be tested on the substrate. With such a substrate as a carrier, there is no way to test each product individually after plastic sealing. It must wait until it is cut into independent units, and then these independent units are transported to the test unit with another carrier board (tray, bowl, reel). On the stage, such a test plan cannot be compared with the ...

AI Technical Summary

Problems solved by technology

The test is based on pieces, which is inefficient and time-consuming

[0003] The usual metal lead frame and MIS metal plated plastic packaging substrate, the pins of a single chip are connected, and the connection relationship of each individual chip cannot be tested on the substrate

With such a substrate as a carrier, there is no way to test each product individually after plastic sealing. It must wait until it is cut into independent units, and then these independent units are transported to the test unit with another carrier board (tray, bowl, reel). On the stage, such a test plan cannot be compared with the batch test plan in production

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