Mobile phone

Abstract

The present application relates to a mobile phone, in which a composite material layer is filled between two adjacent devices of the mobile phone; the composite material layer includes metal foam and thermal conductive silicone grease filled in the internal voids of the metal foam; using the metal foam The void is used as the storage space of thermal grease to avoid the overflow of thermal grease, thereby improving the reusability of thermal grease, and the excellent thermal conductivity of the foam metal itself ensures the thermal conductivity of the composite material layer; at the same time, the foam metal has The better compressibility can effectively eliminate the influence of space size changes caused by the manufacturing and processing errors of each device, and effectively avoid the problem of loss and decline of thermal conductivity caused by error gaps in device manufacturing and processing.

Description

technical field [0001] The present application relates to the technical field of electronic devices, in particular to a mobile phone. Background technique [0002] With the continuous improvement of the performance of mobile phones and the relative shrinkage of the volume, power consumption and heat generation have become more and more concerned issues for users; hot mobile phones directly affect user experience and bring discomfort to users, so is there a good solution? Thermal design has become one of the important design indicators of mobile phones. [0003] At present, heat dissipation is enhanced by filling thermal conductive silicone grease between the chip and the shell and between the PCB board and the shell; however, because the thermal conductive silicone grease is semi-liquid and has strong fluidity, it cannot be reused after maintenance and disassembly, and it is easy to spill over. Other components, therefore, limit where the thermal grease can be used in the p...

AI Technical Summary

Problems solved by technology

[0003] At present, heat dissipation is enhanced by filling thermal conductive silicone grease between the chip and the shell and between the PCB board and the shell; however, because the thermal conductive silicone grease is semi-liquid and has strong fluidity, it cannot be reused after maintenance and disassembly, and it is easy to spill over. Other components, therefore, limit the use of thermal grease in the mobile phone and the recyclable row, not easy to disassemble

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