Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Uniform modification processing method of transparent medium microstructures

A technology of transparent medium and microstructure, applied in the optical field, can solve the problems of difficulty in obtaining microstructure, inconvenience, uneven processing area, etc., and achieve the effect of fast corrosion rate and good uniformity

Active Publication Date: 2016-10-26
CENT SOUTH UNIV
View PDF9 Cites 4 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The traditional femtosecond laser etching method for processing microstructures often has uneven processing areas, which makes it difficult to obtain ideal microstructures, which brings a lot of inconvenience to the general application of laser processing technology in the field of micromanufacturing.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Uniform modification processing method of transparent medium microstructures
  • Uniform modification processing method of transparent medium microstructures
  • Uniform modification processing method of transparent medium microstructures

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0025] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0026] In the first aspect, the present invention provides a method for uniform modification and processing of transparent medium microstructure, such as figure 1 shown, including:

[0027] S101, use the first laser to process the transparent medium, so that the processed transparent medium forms several modified regions, the first laser includes a laser that generates a high-temperature lattice and a laser that reprocesses a high-temperature lattice, and the two l...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a uniform modification processing method of transparent medium microstructures. The uniform modification processing method comprises the following steps: processing a transparent medium by using first laser so that a plurality of modification regions are formed on the processed transparent medium; immersing the modified transparent medium into a corrosion solution to corrode the modification regions, verifying processing uniformity of the transparent medium and forming a plurality of hollow microstructures. The invention provides the uniform modification processing method of the transparent medium microstructures, the first laser comprises laser for generating high-temperature lattices and laser for reprocessing the high-temperature lattices, a preset time interval is reserved between the laser for generating the high-temperature lattices and the laser for reprocessing the high-temperature lattice, when the transparent medium is processed, by light beams which reach the transparent medium at first, the high-temperature lattice can be generated at a gathering position of the light beams by the transparent medium, light beams which reach the transparent medium later immediately process the high-temperature lattice, so that the uniformity of the transparent medium processed by the method is good, and the ideal design effect can be achieved.

Description

technical field [0001] The invention belongs to the field of optical technology, in particular to a method for uniformly modifying and processing transparent medium microstructures. Background technique [0002] Compared with the traditional long-pulse laser, the femtosecond laser has extremely short pulse duration, high peak power, small thermal effect and cold processing, and is widely used in the processing of transparent media. Its laser pulse can be focused in a small area by the objective lens to obtain extremely high power density, and it shows a strong nonlinear phenomenon when it interacts with transparent media. Through the process of avalanche ionization and photoionization, energy can be deposited on the material in a very short time. The focused area generates localized plasma expansion, resulting in a change in the effective refractive index of the material, enabling material modification or removal. The mechanism of action between the femtosecond laser and th...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/362
CPCB23K26/355B23K26/361
Inventor 孙小燕褚东凯胡友旺段吉安王聪
Owner CENT SOUTH UNIV
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products