Electroplating method of integrated circuit
An integrated circuit and coating technology, applied in the direction of circuits, electrical components, electrical solid devices, etc., can solve problems such as poor welding effect and corrosion, and achieve the effect of improving welding effect and uniform second coating
Inactive Publication Date: 2016-10-26
北京首钢微电子有限公司
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Problems solved by technology
[0003] By providing an electroplating method for integrated circuit pins, the present invention solves the technical problem in the prior art that the truncated surface of the integrated circuit pins will be corroded after repeated cooking and screening, and the welding effect is poor.
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Embodiment Construction
[0029] In order to solve the technical problem that the truncated surface of the integrated circuit pin after repeated cooking and screening will be corroded in the prior art, and the welding effect is poor, the invention provides an electroplating method for an integrated circuit, by separating the lead frame of the integrated circuit The obtained integrated circuit unit is electroplated, and the second plating layer formed after electroplating can protect the exposed pin truncated surface of the integrated circuit unit. Even if the integrated circuit unit is repeatedly boiled and screened, it will not be rusted and discolored, and the welding effect is improved.
[0030] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. ...
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The invention relates to the technical field of electroplating of integrated circuit chips, in particular to an electroplating method of an integrated circuit. The electroplating method comprises the steps that first-time electroplating is conducted on a lead frame of the integrated circuit, and a first plating layer is formed on the surface of the lead frame of the integrated circuit; the lead frame, with the formed first plating layer, of the integrated circuit is separated to acquire a plurality of integrated circuit units; and second-time electroplating is conducted on the integrated circuit units, and second plating layers are formed on the surfaces of the integrated circuit units. According to the electroplating method, the integrated circuit units acquired by separating the lead frame of the integrated circuit are electroplated, the second plating layers formed after electroplating can protect the cutting faces of exposed pins of the integrated circuit units so that the integrated circuit units can not be rusted or discolored even after being boiled and screened repeatedly, and the welding effect is improved.
Description
technical field [0001] The invention relates to the technical field of electroplating of integrated circuit chips, in particular to an electroplating method for integrated circuits. Background technique [0002] The existing integrated circuit pin plating technology only implements gold plating on the surface of the pins. However, for special products that require repeated cooking and screening before soldering, although the pins can be plated on the surface of the pins after one electroplating, it is cut off after cutting. The surface is a bare substrate, thus, after repeated cooking and screening, the substrate of the truncated surface of the pin will be corroded, causing the solder to not climb up on the side of the pin, resulting in problems of desoldering and false welding, which will affect the welding effect. Contents of the invention [0003] By providing an electroplating method for integrated circuit pins, the invention solves the technical problem in the prior a...
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Login to View More IPC IPC(8): C25D5/10C25D7/00H01L23/495
CPCC25D5/10C25D7/00H01L23/495
Inventor 马海艳
Owner 北京首钢微电子有限公司