Preparation method of SU8 mold

A mold and fiber optic panel technology, which is applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve problems such as shedding and deformed substrates, reduce internal stress, make the model or structure firm, improve process repetition rate and finish the product rate effect

Inactive Publication Date: 2016-11-02
BEIJING ZHONGKEZIXIN TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] In order to solve the problem that existing SU8 molding technology accumulates thermal stress and internal stress and thus produces deformation or falls off from the substrate, the purpose of the present invention is to provide a kind of preparation method of SU8 mold, it is characterized in that, comprises the following steps:

Method used

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  • Preparation method of SU8 mold

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] The goal of this example is to make a 20 μm thick SU8 mold.

[0026] (1) Uniform glue;

[0027] ① Add SU8 dropwise to the center of the fiber optic panel;

[0028] ② Put the fiber optic panel at an acceleration of 600rpm / min 2 Accelerate from standstill to 600rpm / min for 30s;

[0029] ③At an acceleration of 4000rpm / min 2 Accelerate to 1800rpm / min for 13s;

[0030] ④At an acceleration of 1500rpm / min 2 Accelerate to 2000rpm / min for 38s;

[0031] ⑤ With an acceleration of 1500rpm / min 2 Accelerate to 2200rpm / min for 30s;

[0032] ⑥ With a deceleration rate of 300rpm / min 2 Reduce the speed to 800rpm / min for 15s;

[0033] ⑦ Gradually reduce the speed and stop the glue rejection;

[0034] (2) Pre-baking: Place the fiber optic panel coated with SU8 film on a hot plate and pre-baked. The first stage is 60°C for 7 minutes, and the second stage is 90°C for 8 minutes;

[0035] (3) Exposure: Use 365nm ultraviolet light to expose the SU8 film covered with the mask, and the...

Embodiment 2

[0041] The goal of this example is to make a 35 μm thick SU8 mold.

[0042] (1) Uniform glue;

[0043] ① Add the photoresist dropwise to the center of the fiber optic panel;

[0044] ②Set the fiber optic panel at an acceleration of 560rpm / min 2 Accelerate from standstill to 600rpm / min for 26s;

[0045] ③At an acceleration of 4000rpm / min 2 Accelerate to 1800rpm / min for 15s;

[0046] ④At an acceleration of 2500rpm / min 2 Accelerate to 2000rpm / min for 39s;

[0047] ⑤ With an acceleration of 1000rpm / min 2 Accelerate to 2200rpm / min for 32s;

[0048] ⑥ With a deceleration rate of 300rpm / min 2 Reduce the speed to 800rpm / min for 15s;

[0049] ⑦ Gradually reduce the speed and stop the glue rejection;

[0050] (2) Pre-baking: place the fiber optic panel coated with SU8 film on a hot plate for pre-baking, the first stage is 60°C, 8min, the second stage is 90°C, 12min;

[0051] (3) Exposure: Expose the masked SU8 film with 365nm ultraviolet light, the exposure dose is 155mJ / cm2,...

Embodiment 3

[0057] The goal of this example is to make a 45 μm thick SU8 mold.

[0058] (1) Uniform glue;

[0059] ① Add the photoresist dropwise to the center of the fiber optic panel;

[0060] ② Put the fiber optic panel at an acceleration of 500rpm / min 2 Accelerate from standstill to 600rpm / min for 25s;

[0061] ③At an acceleration of 4000rpm / min 2 Accelerate to 1800 rpm / min for 14.5s;

[0062] ④At an acceleration of 1800 rpm / min 2 Accelerate to 2000 rpm / min for 35s;

[0063] ⑤At an acceleration of 3000 rpm / min 2 Accelerate to 2200 rpm / min for 40s;

[0064] ⑥ With a deceleration rate of 300 rpm / min 2 Reduce the speed to 800 rpm / min for 15s;

[0065] ⑦ Gradually reduce the speed and stop the glue rejection;

[0066] (2) Pre-baking: place the fiber optic panel coated with SU8 film on a hot plate for pre-baking, the first stage is 60°C, 7.8min, the second stage is 90°C, 15min;

[0067] (3) Exposure: Use 365nm ultraviolet light to expose the SU8 film covered with the mask, and t...

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Abstract

The invention relates to a preparation method of a SU8 mold. The preparation method comprises carrying out glue spin-coating, putting an optic fiber faceplate spin-coated with a SU8 coating in a dry heating environment so that a SU8 coating film is formed, exposing the SU8 film covered by a mask under action of UV, post-baking the optic fiber faceplate covered by the exposed SU8 film in a dry heating environment, putting the optic fiber faceplate covered by the post-baked SU8 film into a helium cabinet, cooling the SU8 film and the optic fiber faceplate to the room temperature, carrying out development, putting the formed SU8 mold and the optic fiber faceplate into an oven and carrying out model strengthening treatment. A helium cooling method can reduce temperature change-caused internal stress and through the model strengthening process, a model or structure formed through photoresist development is more firm and has good wear resistance. The preparation method optimizes pre-baking and post-baking parameters so that the SU8 molding structure has low deformation and / or cracking probability and a process repetition rate and a yield are improved.

Description

technical field [0001] The invention relates to the technical field of optical fiber processing, in particular to a method for preparing an SU8 mold. Background technique [0002] Photoresist, also known as photoresist, is a light-sensitive mixed liquid composed of three main components: photosensitive resin, sensitizer and solvent. The technology of photoresist is complicated and there are many varieties. According to its chemical reaction mechanism and development principle, it can be divided into two types: negative gel and positive gel. It is negative gel that forms insoluble substance after light; on the contrary, it is insoluble to some solvents and becomes soluble substance after light is positive gel. Using this property, the photoresist can be used as a coating to etch the required circuit pattern on the surface of the silicon wafer. Photoresists are widely used in the semiconductor field and are commonly used in the production of various chips. With the rapid d...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/38G03F7/40G03F7/26
CPCG03F7/26G03F7/38G03F7/40
Inventor 陈哲张睿王者馥王绪敏殷金龙任鲁风
Owner BEIJING ZHONGKEZIXIN TECH
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