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Substrate conveying device and electronic component mounting device

A substrate conveying and substrate technology, applied in the direction of electrical components, electrical components, etc., can solve the problems of time required, reduction in productivity of electronic component mounting devices, and longer time required for preparation and processing, and achieve the effect of suppressing the reduction in productivity

Active Publication Date: 2020-08-04
JUKI CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As a result, it takes time to change the structure of the device, the time required for the preparation process of the electronic component mounting device becomes longer, and there is a high possibility that the productivity of the electronic component mounting device will decrease.

Method used

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  • Substrate conveying device and electronic component mounting device
  • Substrate conveying device and electronic component mounting device
  • Substrate conveying device and electronic component mounting device

Examples

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Embodiment Construction

[0039] Embodiments according to the present invention will be described below with reference to the drawings, but the present invention is not limited thereto. The components of the embodiments described below can be appropriately combined. Some components may not be used. The constituent elements in the embodiments described below include elements that can be easily imagined by those skilled in the art, substantially the same elements, and elements in the so-called equivalent range.

[0040] In the following description, an XYZ rectangular coordinate system is set, and the positional relationship of each part is demonstrated referring this XYZ rectangular coordinate system. Let the direction parallel to the first axis in the horizontal plane be the X-axis direction, let the direction perpendicular to the first axis and parallel to the second axis in the horizontal plane be the Y-axis direction, and let the direction parallel to the first axis and The direction of the third ...

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PUM

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Abstract

The present invention provides a substrate conveying device capable of suppressing a decrease in productivity. The substrate conveying device comprises guide rails (61, 62) movably supporting a conveyer belt (71) and guiding the substrate conveyed by the conveying belt; a support component (71) detachably supporting the guide rail; a drive pulley (65) rotatably supported by the support component and rotating in a state of being brought into contact with the conveyor belt to move the conveyor belt; a driving motor (53) that generates power to rotate the driving pulley; and a clamp mechanism (90) arranged on at least one of the guide rail and the support component to fix the guide rails and the support component.

Description

technical field [0001] The present invention relates to a substrate conveying device and an electronic component mounting device. Background technique [0002] In an electronic component mounting apparatus, it is sometimes required to mount electronic components on substrates of different sizes. Patent Document 1 discloses a technique of replacing a component-mounted operation module and a substrate transfer module according to the type of substrate. [0003] Patent Document 1: Japanese Patent Laid-Open No. 2008-270322 [0004] As the technology disclosed in Patent Document 1, substrates of different sizes are handled by attaching, detaching, and changing the substrate transfer mechanism itself constituting the substrate transfer module according to the size of the substrates. As a result, it takes time to change the configuration of the device, and the time required for the preparation process of the electronic component mounting device becomes longer, and there is a high...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K13/04
CPCH05K13/0417
Inventor 野原伸和
Owner JUKI CORP