Plasma treatment method for multilayer flexible board and multilayer flexible board
A treatment method, plasma technology, applied in chemical instruments and methods, lamination, layered products, etc., can solve the problems of bulging, affecting quality reliability, uneven board surface, etc., to improve the bulge and improve the board surface. Flatness, the effect of reducing the probability of scrapping
Active Publication Date: 2019-04-16
SHENZHEN KINWONG ELECTRONICS
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Problems solved by technology
[0004] In view of the above-mentioned deficiencies in the prior art, the purpose of the present invention is to provide a plasma treatment method for multi-layer flexible boards and multi-layer flexible boards, aiming at solving the problem of bulging of the non-adhesive delamination area in the existing processing method, resulting in uneven board surface , Problems affecting quality and reliability
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[0026] The present invention provides a plasma processing method for a multilayer soft board and a multilayer soft board. In order to make the objectives, technical solutions and effects of the present invention clearer and clearer, the present invention will be described in further detail below. It should be understood that the specific embodiments described herein are only used to explain the present invention, but not to limit the present invention.
[0027] See Figure 4 , Figure 4 It is a flowchart of a preferred embodiment of a plasma processing method for a multilayer flexible board according to the present invention. As shown in the figure, it includes:
[0028] Step S1: Cover both the upper surface and the lower surface of the multi-layer soft board with a cover plate to form a plasma processing structure, wherein the window area of the cover plate is consistent with the plasma processing area;
[0029] Step S2: Clamp the upper, lower, left and right sides of the plasma p...
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The invention discloses a multilayer soft board plasma treatment method and a multilayer soft board. The plasma treatment method includes the steps: A, respectively covering the upper surface and the lower surface of the multilayer soft board with a cover plate to form a plasma treatment structure; B, clamping the upper portion, the lower portion, the left side and the right side of the plasma treatment structure by clamps; C, setting parameters of the plasma treatment process and starting plasma treatment; D, detaching the cover plates and the clamps after plasma treatment, and passing examination. A windowing area of each cover plate is consistent with an area needing plasma treatment. The problems of bulging and imperfect board burning of non-glued layered areas of the multilayer soft board can be effectively solved, board flatness is improved, scrapping probability is reduced, no liquid medicine permeates into the non-glued layered areas in the wet process, an outer circuit can be smoothly laminated, dry film uncompaction is avoided, and product reliability is improved.
Description
Technical field [0001] The present invention relates to the technical field of manufacturing multi-layer soft boards, in particular to a multi-layer soft board plasma processing method and the multi-layer soft board. Background technique [0002] For the multi-layer flexible board 100 with no glue layered area, such as figure 1 As shown, in the plasma treatment process, due to the effect of vacuuming, such as figure 2 As shown, the non-adhesive layered area will swell and swell, resulting in contact with the discharge anode, and the swelling position will produce deformation and wrinkles, which will cause the board surface to be uneven, such as image 3 Shown. If the situation is serious, it will even cause burn-in, resulting in scrapped products. The multi-layer soft board with bulging deformation in the non-adhesive layered area has the risk of injecting chemicals in the subsequent wet process. At the same time, the dry film cannot be compacted when the outer circuit is made, ...
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IPC IPC(8): B32B38/00
CPCB32B38/0008
Inventor 汤清茹饶秀峰黄云汪明
Owner SHENZHEN KINWONG ELECTRONICS